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Soft, Conformable Gap Filler

May 9, 2011 Electronics Cooling Materials, Compounds, Adhesives, Substrates, New Products

T-Global’s new high performance gap filler TG-X is designed to offer the user the ultimate combination of thermal performance and extreme conformability. TG-X is soft, conformable, cost-effective and offers a thermal performance of 12 W/m-k. In addition to pre-formed thicknesses from 0.5 – 5mm, T-Global also offers custom thicknesses, molded solutions and die cut shapes to meet customer needs. A pressure sensitive adhesive can be added to one or two faces to facilitate production processes.

Learn more from T-Global.

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Electronics Cooling

Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.

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About the Author

Electronics Cooling

Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.

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About the Author

Electronics Cooling

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