In its 28th year, SEMI-THERM will include Invited Speakers, Technical Sessions, Short Courses and an Evening Tutorial as well as vendor exhibits and dedicated vendor sessions for the latest in commercial offerings. SEMI-THERM actively solicits student papers and awards travel stipends and reduced conference fees. Those papers deemed to be among the best in the conference will be invited to be published in IEEE Transactions on Components and Packaging Technologies.
Subjects of Particular Interest include Packaging, Thermal Packaging Materials, Analysis and Modeling, Experimental Work, Thermal Design Process and Multidisciplinary Thermal Management.
Selection of papers for presentation is solely based on an extended abstract. The abstract should provide a complete summary of the proposed paper comprising work or results not previously presented or published. Submitted abstracts should be between 2 and 5 pages of single spaced text giving the key results, findings and conclusions. Abstract deadline is September 12, 2011.