Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
Wolverine’s MicroCool® Division is proud to announce its global License Agreement with Infineon Technologies AG for the development, manufacture, and sale of its current MDT technology combined with existing clad metal material to create a new product innovation, MicroCool®-Clad™.
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
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