Ohmite Manufacturing Company, a provider of thermal solutions and resistors for high current, high voltage and high energy applications, has introduced the Ohmite C Series heatsink which now supports most resistor package sizes from TO-126 to TO-264. Ideal for high power density and small size (1U or 2U) electronic packaging with forced convection cooling, the heat sink provides tool and fixture free assembly operation, large surface area and small space occupation.
In March 2011, Ohmite first introduced the C Series heatsink system. Its new C Series heatsink features modified clips to attach smaller devices (TO-126), as well as additional fins for improved cooling. The integrated clip eliminates the need for hand tools or screw holes and minimizes assembly cost and time.
To learn more visit Ohmite’s website.
