Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
The 18th International Workshop on Thermal Investigations of ICs and Systems will take place Sept. 25-27 in Budapest, Hungary.
The workshops are a series of events to discuss the essential thermal questions of microelectronic microstructures and electronic parts in general. This year, THERMINIC will also stress and thermal-stress-related-reliability issues, both in micro- and opto-electronics fields.
To learn more visit THERMINIC’s website.
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
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