Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
October 2-4, 2012
Dayton, OH
The main objective of this course is to teach attendees to solve thermal problems that they typically encounter during the electronics product design process. Topics include basic and advanced operation of HEAT Designer, a 3D structured mesh fluid analysis software for electronics cooling, determining validity of the created simulation and how to acquire additional information or assistance.
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
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