U.K. startup Versarien will provide a demonstration of porous metal technology and its potential uses in thermal management products during the Electronica exhibition in Munich, Germany this week. The startup was created after CEO Neil Ricketts began collaborating with researchers at the University of Liverpool to examine the use of porous metals for strength-to-weight ratio optimization. According to Ricketts, he saw the potential application for a sponge-like structure that could be used for thermal management in electronic components and launched Versarien to commercialize the technology.
The company’s first product, VersarienCu, will be released at the Electronica exhibition in Munich, Germany. According to Versarien, VersarienCu is a heat transfer material designed for cooling systems in servers, workstations and power conditioning equipment. The new material provides up to ten times “more effective cooling than a microchannel heat sink of a similar size” and “ground-breaking levels of heat transfer between device and cooling fluid.”