Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
March 17-21, 2013
San Jose, Calif.
The 29th annual thermal measurement, modeling and management symposium provides a forum for researchers, members of academia and members of industry to discuss the latest technical developments in the thermal management of electronic devices, components and systems.
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
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