Ohmite Manufacturing, a provider of thermal solutions and resistors for high current, high voltage and high energy applications, has announced two new heat sinks: the C series modular heat sink for use in high power environments and the CP series of cold plate four-pass heat sinks for use with the company’s 1,000 and 2,000 watt TAP series of resistors. The new heat sinks will be showcased by Ohmite Manufacturing at the Applied Power and Electronics Conference and Exposition (APEC) in Long Beach, Calif. in mid-March.
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he C series heat sink offers “high performance, low cost and a compact heat sink with an integrated camming clip system for TO-126, TO-220, TO-247 and TO-264 devices,” according to Ohmite Manufacturing. The new C series heat sink is available in a variety of dimensions for different applications.
According to the company, the new CP series of heat sinks is designed for use with “Ohmite heatsinkable type resistors,” as well as “SCRs, rectifiers, diodes, thyristors and other high-power semiconductor devices.” The CP series features design flexibility for use with a variety of devices and “thermally efficient copper mounting surface for the most efficient heat transfer.”
For more information, visit Ohmite Manufacturing.
