The Bergquist Company has released the Gap Pad 1450 thermally-conductive gap filler. Designed to provide low strain on fragile components, the new gap filler is ideal for a variety of applications, including lighting and LED, computer and peripherals and telecommunications.
Featuring a thermal conductivity of 1.3W/m-K, Gap Pad 1450 is available in six thicknesses from 0.508-3.175mm. The standard sheet size is 8 x 16in, but custom parts are also available. The gap filler includes a permanent liner, which facilitates rework and improves puncture resistance and handling characteristics, and inherent tack, which eliminates the need for potentially thermally-impeding adhesive layers.