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Advancements in Thermal Management 2014

Industry Updates

August 6-7, 2014

Denver, Colorado, USA

Advancements in Thermal Management 2014 is a symposium highlighting recent developments in temperature management, mitigation and control. This event features presentations on the latest thermal mitigation and management technology for electronics packaging, cooling and heating, temperature sensing and control, thermal materials, system design and thermal property optimization. Design, systems and process engineers; materials scientists; academia; CTOs and R&D managers are welcome to attend.

For more information, visit Advancements in Thermal Management.

Author

  • Electronics Cooling

    Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.

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About the Author

Electronics Cooling

Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.

@e_cooling

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