Sponsor

Electronics Cooling

Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

Sponsor

ITherm 2016: Fifteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

Industry Updates

ITherm 2016: Fifteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

May 31 – June 03, 2016

Las Vegas, Nevada, USA

ITherm 2016 is the leading international conference for scientific and engineering exploration of thermal, thermo-mechanical and emerging technology issues associated with electronic devices, packages, and systems. ITherm 2016 will include panel discussions, keynote lectures by prominent speakers, and professional shortcourses.

More information here.

Author

  • Electronics Cooling

    Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.

    View all posts

About the Author

Electronics Cooling

Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.

@e_cooling

Industry Sponsors

Sponsor
Sponsor