The Indium Corporation will feature Heat-Spring®, their new compressible, recyclable, metal thermal interface material, at Strategies in Light on March 1-3 in Santa Clara, California.
The Heat-Spring® interface provides 86 W/mK of thermal conductivity using a pressure range of only 35-100+ psi, according to the company, “is reclaimable and recyclable, and is packaged in custom trays or tape & reel.”
Compared to thermal grease alternatives, “Heat-Spring® helps Avoid the Void™ in high-power LEDs due to its superior conductivity, ease of use, and improved performance over time”, and will not bake out or pump out, said Indium.
Indium adds that the “Heat-Spring® metal thermal interface material is just one of a wide range of Indium Corporation products for the LED assembly industry – from PCB assembly to die-attach to technology-enabling TIMs – which combine superior performance with ease of placement. This reduces cost, increases first-pass yields, reduces field failures, and optimizes profits.”