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Electronics Cooling

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Overcoming Cooling Challenges Downloadable Webinar Now Available

Consumer, Coolers, Design, Heat Exchanger, Industry Updates, News, Plastics, Research, Semiconductor, Test & Measurement

The recent Electronics Cooling with Autodesk CFD Webinar on how to ensure proper cooling as the electronics used in products change and improve is now available for download.

Exploring ‘invisible elements’ like airflow and heat transfer, speaker Jim Byrne talks through how to maximize product performance by overcoming common electronics challenges like reduction in product size, increase in overall product performance, reducing overall cost, extending product lifespan, and optimizing circuit board design.

To download the webinar, click here.

Author

  • Electronics Cooling

    Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.

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About the Author

Electronics Cooling

Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.

@e_cooling

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