AIAA Thermophysics Conference
June 13-17
Washington, D.C., U.S.A.
“The Thermophysics Conference covers all aspects of thermal science and engineering related to aerospace applications. Topics range from basic research and development to applied and advanced technology, including novel experimental and computational observations, interdisciplinary papers that bridge theoretical and experimental approaches, and papers that provide innovative concepts and analyses.”
Read more here.
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Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.







