Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
Tempmeko 2016
June 26-July 1
Poland
“The Symposium aim is the exchange of information and views among the members of international scientific community, professional metrologists, manufacturers of measurement equipment, engineers and students working in the field of the temperature metrology.”
Learn more here.
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
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