In recent years, Cradle has created and launched an easy to use, real-time, printed circuit board thermal analysis tool for electrical designers, called the Cradle PICLS.
PICLS enables electrical designers to instantly evaluate how changes to circuit board design affect thermal performance, thus reducing downstream rework. Analysis data can be passed seamlessly from the PCB design stage to the mechanical design stage, and operates in 2D.
Cradle PICLS was an outgrowth of a close working relationship with Hitachi Mito Engineering, an industrial manufacturer who designs its own electrical equipment.
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Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.







