Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
Master Bond has released their new two part epoxy, EP30AN-1.
EP30AN-1 is ideal for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity and NASA low outgassing approval. It offers superb dimensional stability and superior physical strength properties.
EP30AN-1 is also an excellent adhesive and sealant forming durable, rigid bonds.
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
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