CoolIT Systems has partnered with Intel to develop Direct Liquid Cooling solutions for Intel Xeon Scalable CPUs, including the recently announced Advanced Performance processors (codename Cascade Lake) coming in the first half of 2019.
Cascade Lake represents a new class of Intel Xeon Scalable processors designed for demanding high-performance computing (HPC), artificial intelligence (AI) and infrastructure-as-a-service (IaaS) workloads. The processor incorporates a performance optimized multi-chip package to deliver up to 48 cores per CPU and 12 DDR4 memory channels per socket.
CoolIT’s modular, rack-based Direct Liquid Cooling technology, Rack DCLC, enables increases in rack density, component performance and power efficiencies and can install into any server or rack, ensuring ease of adoption and maintenance. These solutions for Intel Xeon Scalable Processors are compatible with CoolIT’s Rack DCLC product portfolio including Coolant Distribution Units and Rack Manifolds. The former are designed to manage the distribution of clean, treated coolant to and from a network of IT cabinets, and accepts ASHRAE W4 warm facility water and manages 750kW of processor load per network. The latter, CoolIT Systems’ Rack Manifolds, are made of stainless steel, rendering them sufficiently robust. Combined with dry-break, dripless Quick Disconnects from Staubli, these manifolds are safe and effective building blocks when paired with Rack DCLC Passive Coldplate Loops, which are specifically designed for the latest high TDP processors from Intel, NVIDIA and AMD.
“CoolIT is proud to support Intel Xeon Scalable CPUs with high density Direct Liquid Cooling,” said CoolIT Systems Vice President of Business Development and Product Marketing, Patrick McGinn. “HPC users can now unlock the benefits of CoolIT technology through any number of industry leading OEM partners including Intel, Cray, HPE, and Dell.”