
Intermark’s line of products for thermal management include basic thermal pads (0.8 W/m*K), high conductivity pads (5.0 W/m*K & 7.0 W/m*K), non-silicone pads (0.8 W/m*K), and thermal and EMC in one pad (1.1 W/m*K).
Author
-
View all posts
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.







