May 8 -10, Winterthur Museum & Gardens, Wilmington, Del.
From its origins in polyimide materials and processes, The Symposium on Polymers has evolved into a comprehensive technical meeting with a broad focus on organic and polymeric materials with application in all areas of the microelectronics industry – from wafer level through standard and advanced level packaging.
· Buffer Coating Applications
· Front-End of Line Applications
· Back-End of Line Applications
· Structure Property Relationships and Characterization
· Emerging and Novel Applications
Author
-
View all posts
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.







