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Electronics Cooling

Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

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2016 Electronics Packaging Symposium

Industry Updates

2016 Electronics Packaging Symposium
Oct. 5 – 8, 2016
Binghamton, NY, USA

TECHNOLOGY ADVANCES IN SMALL SCALE SYSTEMS & MICROELECTRONICS PACKAGING

The 2 day program will include Keynote Lectures, Technical Presentations, a Half-day 2.5/3D Workshop, and a Student Poster Session on topics including:
-3D Packaging
-Thermal Challenges
-Flexible and Additive Electronics
-MEMS, Sensors, and Microfluidics
-Material Challenges
-Harsh Environments
-Energy Conversion and Storage
-Embedded Electronics

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Author

  • Electronics Cooling

    Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.

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About the Author

Electronics Cooling

Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.

@e_cooling

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