SEMI-THERM takes place this week in San Jose, Calif. Below are photos taken by Electronics Cooling staff. Photos, from top, include: Electronics Cooling editors Jim Wilson and Bruce Guenin pose with the latest issue of Electronics Cooling. Business Manager Casey Goodwin chats with a visitor at the Electronics Cooling booth. A view of the exhibit hall. The … [Read more...]
SEMI-THERM Presents Executive Briefing
This year, SEMI-THERM has introduced the Executive Briefing: Thermal Management Market Visions & Strategies conference in conjunction with the SEMI-THERM annual symposium. Aimed at bringing technology and technical leaders, C-Level executives and engineering, product development and business managers together, the executive briefing program will focus on current market … [Read more...]
Low-Viscosity Thermally Conductive Silicone Compound
Fujipoly introduces its SARCON SPG-20A, a low-viscosity thermally conductive silicone compound. When applied between a heat-generating component and a nearby heat sink or spreader, the very low compression, form-in-place material fills gaps up to .50 mm in height. According to the company, "The form stable thermal compound requires no heat curing, will not cause corrosion on … [Read more...]
General Purpose Thermoreflectance Analyzer Released
Microsanj announces a new product to premiere at SEMI-THERM. The latest addition to the Thermoreflectance Thermal Imaging product line is the NT100A General Purpose Thermoreflectance Analyzer. The analyzers include the NT100: General Purpose; NT200/210: 100nsec, submicron transient; NT300/310: Through-the-substrate (flip mount); and NT410: 800psec high performace. Visit … [Read more...]
Measured Thermal Resistance of Microbumps in 3D Chip Stacks
Evan Colgan, Jamil Wakil, IBM Introduction As it becomes increasingly difficult to scale devices down to improve performance, alternate approaches such as 3D chip stacks are being developed, which improve system performance by increasing the interconnect density and reducing the interconnect length(1). The stacking of multiple chips with through silicon vias (TSV) and fine … [Read more...]
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