Fujipoly will be at SEMI-THERM showcasing its Sarcon® 50G-Hm high performance, low resistance gap filler pad, Sarcon® GR-SL low compression thermal gap filler material, and Sarcon® SG-26SL silicone-based thermal grease. The Sarcon® 50G-Hm is manufactured with a special low-tac top surface. The one-sided treatment is less sticky than the opposing surface allowing the thermal … [Read more...]
Electronics Cooling Buyers’ Guide Issue Now Online
Don’t miss out on the March 2012 issue of Electronics Cooling, which includes the 2012 Buyers' Guide, feature articles on Iconic Winds: A New Frontier for Air Cooling, Thermal Ground Plane Technology Impacts Electronics Packaging, Enhancement of Microchannel Cooling with Oblique Technology, as well as technical briefs. If you would like to receive your free copy of … [Read more...]
Enhancement of Microchannel Cooling with Oblique Technology
Microchannel cooling has emerged as an effective method to enhance cooling for electronics devices [1]. However, the problem of boundary layer development, as liquid coolant travels downstream, persists in conventional microchannel heatsinks. Consequently, convective heat transfer performance of a heat sink deteriorates in the axial direction, resulting in elevated maximum … [Read more...]
Thermal Ground Plane Vapor Chamber Heat Spreaders for High Power and Packaging Density Electronic Systems
SINCE 2008, collaborative research conducted at Raytheon Company, Thermacore Incorporated, Purdue University and Georgia Tech Research Institute has pursued the development of Thermal Ground Plane (TGP) technology. The DARPA-sponsored Radio Frequency Thermal Ground Plane (RFTGP) program focused on the development of high effective conductivity (keff >1000W/mK), low … [Read more...]
Calculation Corner: Transient Modeling of a High Power IC Package, Part 2
Part 1 can be found here. Part 1 of this article provided the groundwork for the present discussion [1]. It demonstrated the use of three different methodologies for performing a transient thermal analysis of a high-power IC package attached to a heat sink. These include the finite element analysis (FEA) method and a numerical model, which represents the package and heat sink … [Read more...]
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