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Electronics Cooling

Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting

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Thermal Facts & Fairy Tales: Heat Spreading Revisited

 

AS PROMISED IN MY editorial of the 2011 Fall issue, I will devote this issue’s column on the topic of heat spreading. The reason is that I, while writing a white paper on basic thermal management for LED applications, found some unexpected facts pointing at problems of interpretation of heat spreading data for dual layers when using the often-used heat spreading equations. In … [Read more...]

Editorial: Forward Looking

 

IN THE LAST WINTER ISSUE OF ELECTRONICS COOLING, our friend and colleague Bob Simons used his editorial column to inform us that he was resigning his position as an associate technical editor and this issue will be his last. The title of Bob’s editorial was “Looking Back” so it seems fitting to include the term forward in the title of this editorial and to use this space to … [Read more...]

High Temperature Felt and Millboard Ideal for Industrial Appliances

 

Morgan Thermal Ceramics announces the availability of its Superwool® HT™ Felt and Superwool® HT™ Millboard, ideal for fabricating gaskets and heat shields for industrial appliances, including ovens, fryers and cooking equipment. The lightweight, multi-purpose products are available in a full range of sizes, thicknesses and densities and offer equivalent performance to … [Read more...]

Thermal Fuse Series Meets High Current Application Requirements

 

In response to market demand for applications requiring thermal cut-outs with high current capabilities, Selco Products has introduced the SWTC3 Thermal Fuse Series. The SWTC3 features a 20 Amp rating at 120/250VAC and is suited for use in a wide range of applications. Selco’s new SWTC3 and original SWTC (10 Amp continuous duty rated) thermal cutoffs are designed to provide … [Read more...]

Thin Label Material Made of 0.5 Mil Polyimide Film

 

Polyonics has designed an ultra-thin, white coated, polyimide label material that uses a 0.5 mil film for space constrained electronics. The XF-616 is a high temperature, thermal transfer printable material with an aggressive acrylic adhesive to insure superior bond permanence. This label material is designed to provide a 20% lower profile and survive the harsh environments of … [Read more...]

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