INTRODUCTION Over the last 10 years, there has been a well-documented increase in the energy density of electronic devices. As this energy density has gone up, so has the heat dissipation on electronics packages. In response to this challenge, significant research has taken place to develop chip level cooling systems to meet heat fluxes in excess of 1000W/cm2. As stated … [Read more...]
About the Author
James Burnett is the director of Government Business Development at Aspen Systems Inc. Burnett has over 30 years of experience as an engineer, program manager and technologist, developing materials and processes for applications that provide structural and thermal solutions for electronic packaging engineers. Activities include developing polymer and metal matrix composite materials and processing and structural designs that enable effective thermal management in high temperature devices. His recent focus has been identifying applications and designs for active cooling of electronics using Aspen’s unique miniature refrigeration technology.