Figure 1. Various leadframe and BGA packages Introduction The well-established trend within the electronics industry to provide everincreasing computing power at less cost seems to defy the laws of economics.However, this industry has not been able to suspend the laws of physics. Eachcalculation by each of the millions of transistors in the modern personalcomputer is … [Read more...]
Thermal Conductivity
For most calculations regarding the thermal analysis of electronic systems, thermal conductivities of solid materials are required. It is felt that many designers would welcome a comprehensive list showing these values for certain classes of objects, such as PCB materials, leadframes, molding compounds, alloys etc.. This issue starts with 45 leadframe materials, the data for … [Read more...]
A simple method to estimate heat sink air flow bypass
Introduction After selecting or designing a heat sink based upon a given air velocity orvolumetric flow rate through the fins, the thermal designer needs to determinethe total amount of flow which must be delivered in the duct or card passagecontaining the module w with heat sink. As shown in Figure 1, some of the flowwill go around or bypass the heat sink. In fact, depending … [Read more...]
Electrical temperature measurement using semiconductors
Introduction Semiconductor junctions offer many useful properties including inherentcharacteristics which are well suited to temperature measurement. Within theelectronics cooling arena, these properties form the basis for "theelectrical method of junction temperature measurement" and are used formeasurement of junction temperatures within operating semiconductor devices. They … [Read more...]
Measuring chip temperatures with thermochromic liquid crystals
Introduction Measurement of the temperature distribution of an operating electroniccomponent, including its junction and case temperatures, is necessary tocompletely characterize the thermal and electrical performance of today's highpower density electronic components. As part of the characterization process,thermal designers must be able to predict and verify the … [Read more...]
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