The potential for low temperature enhancement of CMOS performance has been recognized for some time, going back as far as the late 1960's and mid-1970's. A collection of articles focusing on low temperature electronics is included in the book by Kirschman(1) where a number of researchers [2-6] have identified the advantages of operating electronics at low temperatures. Jaeger … [Read more...]
Multilayer circuitry on metal substrates
Today's electronics are becoming smaller and faster, resulting in increased power densities and greater risk of thermal problems. Thermal dissipation requirements thus need to be satisfied by the use of several cooling mechanisms. The cooling systems may include conduction, convection and radiation cooling. Conduction can be the most efficient mode of heat transfer and about … [Read more...]
A system level cooling solution for cellular phone applications
Improving thermal performance of electronic components is very challenging due to the increasing power density and decreasing module sizes. The design trade off between electrical and mechanical characteristics and the cost of manufacturing MCM products requires innovative solutions to improve device thermal performance. The primary cooling path in portable electronics serves … [Read more...]
Determining the junction temperature in a semiconductor package, part III the use of the junction-to-board thermal characterization parameter
In recent issues, this column has dealt with the use of a number of thermal metrics to calculate the junction temperature of integrated circuits under various conditions. These metrics explored were JA, JC, and JT. To summarize the uses of these metrics: JA represents the junction-to-air thermal resistance for a package tested in an industry-standard test environment. It is … [Read more...]
How Thermal Conductivity Relates to Electrical Conductivity
Because the accurate determination of thermal conductivity is a demanding task (often not recognized by either designers or vendors), methods, based on the measurement of another physical property that is uniquely coupled to thermal conductivity, are very challenging. One such method is based on the so-called Wiedemann-Franz Law, which links the thermal conductivity to the … [Read more...]
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