AI accelerators, electrified platforms, advanced packaging, and dense power electronics are pushing thermal design to new limits. Higher power densities and tighter design margins are increasing the need for precise measurement, integrated simulation, and earlier physical validation.

The 2026 Thermal Test & Design New Product Guide from Electronics Cooling gives thermal engineers a practical reference to products introduced or significantly updated within the past 18 months, with key specifications and application-focused notes to support thermal testing, characterization, design, and validation.

The guide includes:

New Products with Vendor Details, Key Specifications & Design Notes

• Thermal Test & Measurement
  • Thermal imaging and transient characterization
  • Material property measurement
  • Airflow visualization and temperature sensing
  • Thermal test chambers and analysis tools
• Thermal Simulation & Design Tools
  • CFD and FEA platforms
  • Electro-thermal and multiphysics modeling
  • Advanced packaging workflows
  • AI-assisted optimization and accelerated simulation
• Thermal Interface & Cooling Innovations
  • Thermal interface materials and gap fillers
  • Phase change materials
  • High-density cooling hardware
  • Technologies supporting thermal cycling and validation

ADDITIONAL INSIGHTS

• Forces driving thermal test & design product development
• Design and validation takeaways for improving simulation-to-test correlation
• Considerations for earlier, digitally integrated thermal validation

Download your free 2026 Thermal Test & Design New Product Guide now.