july, 2020

06julAll Day08EuroSimE


Event Details

In place of the in-person event, EuroSimE 2020 will be held as a virtual conference.

  • Three live Webinars to be held on July 6, 7 and 8, 2020, having presentations from scientists and executives affilated with  AT&S — Auburn University — Huawei — IMB Barcelona — IMEC — Intel — Jade University — Lamar University — LG electronics — Magna Powertrain — Materials Center Leoben — NXP Semiconductors — Robert Bosch GmbH — Saarland University and Siemens AG.
  • On-demand content, available through July 6 27, 2020, inclusive, hosting 85 pre-recorded presentations, including 11 from the European Commission funded Important Project of Common European Interest (IPCEI) on Microelectronics. There will also be a live-chat feature with the speakers and community.
  • Access to the EuroSimE 2020 Conference proceedings to be published in IEEE Xplore.

International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.



july 6 (Monday) - 8 (Wednesday)

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