After studying and evaluating the announcements, guidance, and news released by relevant authorities, we are disappointed to announce that the in-person gathering of ITherm 2020, scheduled to be held May 26-29^th, has been cancelled.

In place of the in-person event, ITherm 2020 will be held as a virtual conference at a later date. The Organizing Committee is in the process of making arrangements to convert the event into this virtual format. Information regarding the virtual event, including how and when it will occur, will be confirmed in the coming days.

Sponsored by the IEEE’s Electronics Packaging Society (EPS), ITherm 2020 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. The first ITherm Conference was held in 1988, making this the 31st year of the Conference Series.