IMAPS 2018 - Pasadena
09oct(oct 9)1:00 am11(oct 11)1:00 amIMAPS 2018 - Pasadena51st Symposium on Microelectronics
Event Details
The 51st International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2018 Technical Committee
Event Details
The 51st International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2018 Technical Committee seeks original papers that present progress on technologies throughout the entire microelectronics/packaging supply chain. The Symposium will feature 5 technical tracks, plus our Interactive Poster Session, that span the three days of sessions on:
| TRACK 1: SiP/SiM (System Solutions) |
TRACK 2: Wafer Level/Panel Level (Advanced RDL) |
TRACK 3: High Performance / High Reliability |
TRACK 4: Flip Chip/2.5D/3D/Optical (Advanced Package) |
TRACK 5: Advanced Process & Materials (Enabling Technologies) |
|
PLANNED SESSIONS: • System Design & Integration |
PLANNED SESSIONS: • Wafer-Level Fan Out |
PLANNED SESSIONS: • High Reliability – Defense/Aero |
PLANNED SESSIONS: • Large Body / Small Body FC |
PLANNED SESSIONS: • Substrate Technology |
|
TRACK 6:
INTERACTIVE POSTER SESSION – “Posters & Pizza Lunch” |
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Time
9 (Tuesday) 1:00 am - 11 (Thursday) 1:00 am(GMT+00:00)
Location
Pasadena Convention Center
300 E Green St, Pasadena, CA 91101
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