NEW THIS YEAR – A TECHNOLOGY CROSS-OVER EXTRAVAGANZA! CICMT, High Temperature, and Thermal & Power Packaging come together for a great opportunity for you…One
NEW THIS YEAR – A TECHNOLOGY CROSS-OVER EXTRAVAGANZA! CICMT, High Temperature, and Thermal & Power Packaging come together for a great opportunity for you…One location | One registration | Three times the content, networking, and learning! The Thermal event has also been upgraded from a Workshop to a full Conference to allow for more attendees, exhibitors, speakers, and networking!
Previously, this event has been organized annually by IMAPS (since 1992 in Workshop format) to specifically address current market needs and corresponding technical developments for electronics thermal management. Presentations on leading-edge developments in thermal management components, materials, and systems solutions for effectively dissipating heat from microelectronic devices and systems are sought from industry and academia. The Workshop emphasizes practical, high-performance solutions that target current and evolving requirements in mobile, computing, telecom, power electronics, military, and aerospace systems. Single-company product development concepts are acceptable subjects; however, all abstracts will be judged on their novelty and innovative contributions to the industry knowledge.
april 26 (Monday) - 29 (Thursday)
Albuquerque Marriott Pyramid North
5151 San Francisco Rd NE