Lead research engineer at GE Global Research in Niskayuna, New York. His research includes development of novel thermal management technologies for aviation, healthcare and transportation systems. Before starting this role in 2013, he received his MS and PhD in Mechanical Engineering at Auburn University, Alabama where he focused on the development of phase change liquid cooling techniques for high power electronics in terrestrial and reduced gravity environments. Dr. Thiagarajan holds one granted patent along with more than 7 pending patents. He also has more than 10 peer-reviewed articles and publications in the field of thermal management.
Jim is the Lead Mechanical Engineer at Sechan Electronics where he has worked for sixteen years, developing electronics defense systems. He earned a BSME from Lehigh University in 1980, and a MSME from the Georgia Institute of Technology in 1983. He is a registered Professional Engineer in Pennsylvania. Jim’s prior experiences include development of medical products, and design and optimization of industrial products and systems.
Dr. Vinit Singh is the CTO of NuCurrent, a leader of thin, high quality (Q) factor, printed wireless power transfer solutions. As CTO of NuCurrent, Singh guides the company’s technology focus, IP leadership efforts, and product development roadmap. He received his BS from Indian Institute of Technology Roorkee and PhD in Electrical Engineering from North Carolina State University. While attending the university, he developed wireless telemetry systems for the world’s first Artificial Retina Implant, which was recognized as a 2009 R&D 100 award winner.
Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
Dr. MP Divakar is founder and CEO of Stack Design Automation, a company focused on developing ECAD-MCAD integration software platform, design stacks, services and training for next-generation electronics including MEMS, 3DIC, Printed Electronics, Wearable & Stretchable Electronics and the Internet-of-Things. He has more than 18 years of experience in electronic packaging development in microwave-, millimeter-wave and RF-communications, power electronics and MEMS at component-, module- and system-level applications. He has also worked on hardware development for semiconductor test and high speed communication fabric. His expertise includes electronic & optoelectronic packaging (JEDEC, IPC, MIL-STD, & Telcordia), thermal and thermo-mechanical modeling, characterization and finite element simulation. He has more than 30 publications, 10 issued patents and many applications pending. He holds PhD from Arizona State University, MSc from The University of Calgary, and B.Eng from the University of Mysore (India).
Jesse Galloway is a member of the technical staff at ON Semiconductor. He supports advanced package reliability along with thermal and mechanical characterization. His specialties include thermal and mechanical simulation and experimental measurements related to reliability. He has worked in the electronics package industry for more than 25 years. Jesse currently lives in Phoenix, AZ and enjoys hiking and bicycling.
