The 31st international workshop on THERMal INvestigations of ICs and systems (THERMINIC) took place on 24–26 September 2025 in Naples, Italy, hosted at the Centro Congressi (Conference Center) of University Federico II. This year’s workshop not only broke attendance records but also showcased the seamless integration of cutting-edge research and industrial innovation in the … [Read more...]
Converter Family Maximizes Power Supply Efficiency, Minimizes Footprint
Power Integrations introduced HiperLCS, a family of high-voltage LLC power supply ICs that incorporate the controller, high- and low-side drivers, and both MOSFETs into a single low-cost package. Highly integrated HiperLCS ICs offer the flexibility to optimize designs either for high efficiency, with a maximum efficiency of better than 97%, or for size, by leveraging … [Read more...]
Thermal characterization of power ICs using virtual junction temperature
Thermal experts generally view thermal resistance as a measurable property of a semiconductor device. A system designer, who designs an appliance, is usually not a thermal expert. The system designer just needs a way to determine the size of the external heat sink. At high heat sink temperatures, less power dissipation is allowed in the device. The ratio at which case … [Read more...]
