Figure 1. Thermal analog model of an OSP enclosure Introduction Over the past twenty years, telecommunications electronics have become increasingly decentralized – moving ever furtherfrom the controlled and protected environment of the Central Office intothe…read more
Standardizing heat sink characterization for forced convection
September 1st, 1997
Figure 1. Wind tunnel configuration Introduction While there has been a flurry of activity inliterature addressing the behavior of heat sinks in computer electronics,the reusability of the data presented in these papers has been somewhatlimited…read more
One-dimensional heat flow
September 1st, 1997
The simplest heat flow situation is that described as “one-dimensional heat flow”. The Figure illustrates a one-dimensional heat flow situation. It shows heat flowing in one face of an object and out the opposite face.…read more
Integrated thermal network models are still useful
September 1st, 1997
Figure 1: Basic discretization of parallel board arrangement Introduction While electronic systems thermal managementgrows in complexity, the challenge of integrating thermal constraints intothe product design process remains constant. The evolution of compactcomponent models highlights the…read more
Highly emissive ion beam textured surfaces for improved cooling of electronic devices
September 1st, 1997
Continuous improvements in the cooling of electronic systems will berequired to keep pace with the rapid development of higher power chips.Currently, effective cooling relies (in part) on high surface area heatexchangers. Further improvements could be…read more
Coefficient of thermal expansion
September 1st, 1997
As complexity increases and dies and packages become even larger, temperature gradients also increase, leading to problems with thermal mismatch. Hence, thermomechanical analysis grows in importance. Apart from the temperature differences, the most important parameter…read more
A practical formula for air-cooled boards in ventilated enclosures
September 1st, 1997
Fig. 1 – Ventilated cabinet Introduction Natural air convection is commonly applied as a cooling technique for electronic equipment of moderate power density such as telecommunication boxes. The main advantage of natural convection isits intrinsic…read more
Thermal resistance: an oxymoron?
May 1st, 1997
Introduction Dark light, deafening silence, cruel kindness, living dead, fuzzy logic,honest politics. The adjectives seem to contradict the substantives; such afigure of speech is called an oxymoron. It will be argued within this articlethat ‘thermal…read more
Thermal Conductivity
May 1st, 1997
For most calculations regarding the thermal analysis of electronic systems, thermal conductivities of solid materials are required. It is felt that many designers would welcome a comprehensive list showing these values for certain classes of…read more
Packaging: designing for thermal performance
May 1st, 1997
Figure 1. Various leadframe and BGA packages Introduction The well-established trend within the electronics industry to provide everincreasing computing power at less cost seems to defy the laws of economics.However, this industry has not been…read more
Forced convection cooling of airborne electronics
May 1st, 1997
Figure 1. AFT description Fin pitch = 25.01 per in = 985 per mPlate spacing, b = 0.200 in = 5.08 x 10-3 m Fin Length = 0.111 in = 2.8 x 10-3 m Flow…read more
Calculating interface resistance
May 1st, 1997
Figure 1. Ceramic Package – Aluminum Heat SinkAssembly Introduction The exposed surface area of many of today’s high powered electronic packagesis no longer sufficient for the removal of the heat generated during normaloperation. Heat sinks…read more
A simple method to estimate heat sink air flow bypass
May 1st, 1997
Introduction After selecting or designing a heat sink based upon a given air velocity orvolumetric flow rate through the fins, the thermal designer needs to determinethe total amount of flow which must be delivered in…read more
Temperature measurement using optical fibers
January 1st, 1997
Introduction Fiber optic temperature measurement has been in use for decades1.The most prevalent methods are fluorescent and radiation thermometry, also knownas pyrometry. Fluorescent temperature measurement is used for lower-rangemeasurements from -200°C to +450°C. Pyrometry best…read more
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