Rapid growth in the use of Internet and telecommunication services has created unique yet critical demands on the power required to energize this network. Continuing market requirements for higher-speed access – coupled with expanding needs…read more
The thermal conductivity of fluids
September 1st, 2000
About 10-15 years ago, fluids, either directly (mainly Fluorocarbons), or indirectly (cold plates flushed with water) cooled the majority of mainframe computers. Nowadays, the expected increase in heat flux density causes a renewed interest in…read more
The increasing importance of thermal test dies
September 1st, 2000
Thermal test dies are among the major tools used in package thermal design qualification. They are usually simple chips, containing heaters and temperature sensors. The sensors measure the temperature on the chip surface as a…read more
Natural convection modeling of heat sinks using web-based tools
September 1st, 2000
Heat transfer in electronic packages is a complex problem involving a network of resistive paths for the various laminated structures, bonding adhesives, lead frames, and attachment mechanisms, such as ball grid arrays. However, despite the…read more
Low temperature electronic cooling
September 1st, 2000
The potential for low temperature enhancement of CMOS performance has been recognized for some time, going back as far as the late 1960′s and mid-1970′s. A collection of articles focusing on low temperature electronics is…read more
High accuracy thermal interface resistance measurement using a transient method
September 1st, 2000
Heat dissipation of active devices has become one of the limiting factors in further miniaturization. While component manufacturers succeed in decreasing the overall thermal resistance of their packages, the thermal interface resistance to the board…read more
Determining the junction temperature in a semiconductor package, part IV – localized heat generation on the die
September 1st, 2000
In the standard thermal test environment, thermal test chips are designed to dissipate the applied power uniformly over most of the die surface. However, in many situations of practical interest, the power is dissipated over…read more
Thermal challenges in the telecom and networks industry
May 1st, 2000
Figure 1: Telecom Equipment Operating EnvironmentsThere are two main reasons for doing thermal design in the telecommunication industry. The first is to ensure functionality of the equipment and system when subjected to extreme environments. The…read more
Temperature of in-line array of electronic components simulated by rectangular blocks
May 1st, 2000
An earlier work by the authors (Molki et al., 1995) discussed the adiabatic heat transfer coefficient of rectangular blocks situated in an in-line array. In real circuit boards, heat is generated by a number of…read more
Low Noise Axial Fan Applications
May 1st, 2000
There are three basics to creating low-noise axial fan applications: airflow path design initial fan design analysis and correction of specific acoustical responses in the physical model Each is important and contributes to the…read more
Determining the junction temperature in a semiconductor package, part III the use of the junction-to-board thermal characterization parameter
May 1st, 2000
In recent issues, this column has dealt with the use of a number of thermal metrics to calculate the junction temperature of integrated circuits under various conditions. These metrics explored were JA, JC, and JT.…read more
Application of thermoelectric coolers for module cooling enhancement
May 1st, 2000
Figure 1. Cooling power density for different T.E. cooler designs (adaped from Vandersande and Fleurial [6]). Introduction Many advances in computer technology have been made possible by increases in the packaging density of electronics. These…read more
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