Fujipoly has introduced specially formulated thermal interface gap pad materials that simplify board-level maintenance by reducing material tearing during disassembly for re-work and repair. Sarcon GR-H and XR-H thermal interface materials feature a unique hardened top surface. This one-sided surface treatment is less tacky than the opposing contact side, allowing the thermal pad to consistently adhere to either the electrical component or opposing heat sink. The hard surface releases quickly and easily from its component without tearing or damage. GR-H and XR-H gap filler materials are available in eight different formulations and offer thermal conductivity from 1.2 to 17.0 W/moK.
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