ABSTRACT Cooling fan noise is a system property determined as much by thermal and mechanical design and fan selection as by a fan’s acoustical design. While even the quietest fan can be used in a noisy manner, a significant fraction of unpleasant surprises can be avoided. NOMENCLATURE C Numerical constant D … [Read more...]
Some New Cooling Ideas are Needed Here
In the 1920s, the field of physics was in disarray. The reason was that many careful observations and experimental data could only be explained by conflicting theories; for example, some proved that light was a wave, while others provided it had a particle-like nature. Other experiments, such as those in black-body radiation or the photoelectric effect, could not be explained … [Read more...]
The Impact of Hybrid Cooling on the Power and Computational Efficiency of Cloud Computing Racks
A noteworthy trend in data centers is to reduce the power consumption of cooling facilities by increasing the supplied temperature to IT services, thereby requiring less work within the cooling facility to provide the targeted temperature. This will result in lower overall power consumption and higher computational effectiveness. However, higher inlet water temperature to the … [Read more...]
High-loading Graphene Composites Enhance Thermal Conductivity
It is well known that incorporating graphene fillers to the base (matrix) of a composite thermal interface material (TIM) can improve the resulting thermal conductivity of the composite. In fact, the intrinsic thermal conductivity of large graphene layers exceeds that of the high-quality bulk graphite, which itself is very high: 2000 W m−1 K−1 . But most of the studies of … [Read more...]
How My Electronics Should Be Oriented: A Thermal Point of View Study to Understand the Impact of Orientation on Internal Air Temperature
Authored by: Tejas Manohar Kesarkar and Nitesh Kumar Sardana Abstract— Modern day electronics work in varied thermal conditions. The increase in demand of electronics has led to miniaturization, use of plastic housing, and more applications from the existing electronics in the market. The model for analysis consists of multi-layered Cu-FR4 Printed Circuit Board (PCB) … [Read more...]
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