Binghamton University faculty member Bahgat Sammakia received the 2010 ITherm Achievement Award during the 12th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems in honor of his contributions to electronics, thermal and thermomechanical research, as well as his service to the electronics thermal management community. Sammakia, director of the Small Scale Systems Integration and Packaging Center, a New York State Center of Excellence, also serves as BU’s executive director for economic development. Sammakia, a longtime IBM engineer, joined Binghamton’s faculty in 1998. He holds 14 U.S. patents and has published more than 150 technical papers in refereed journals and conference proceedings.
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Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.