Surface Mount Techniques (SMT) announces stencil/screen printers specifically designed for thermal grease applications. Highly concentrated heat sources found in ever shrinking electronic designs have increased the demand for better heat dissipation. The demand is seen…read more
Thermal Gap Fillers Combine High Performance, Low Pricing
August 23rd, 2010
New TP-S30 thermal interface pads from MH&W International provide 3.0 W/mK of thermal conductivity between hot components and heat sinks at lower costs than competing gap filler materials. Pads of TP-S30 thermal gap fillers are…read more
Green Fan Tray Operates When Ambient Heat Reaches 88˚F
August 23rd, 2010
Gardtec Incorporated has released a Green Fan Tray assembly, designed around the Gardtec Green Fan Cord, which allows the fan trays to operate only when the system ambient heat reaches 88 degrees Fahrenheit. The fan…read more
Oxley Supply Nav Lights for EADS Atlante UAV
August 23rd, 2010
Oxley Developments has been awarded a contract to supply aircraft navigation LED lights to the European Aeronautic Defence and Space Company (EADS) for its Atlante unmanned air vehicle (UAV) program. Oxley will supply a full…read more
Report Sees $6 Billion OLED Lighting Markets by 2015
August 23rd, 2010
NanoMarkets has just published its latest forecasts of worldwide OLED lighting markets. According to NanoMarkets, OLED lighting will generate $6 billion in revenues by 2015 driven by the need for cost efficient lighting in a…read more
City of Chicago Testing New Borealis LED Streetlights
August 23rd, 2010
The City of Chicago has installed new Borealis LED streetlights as part of a test pilot program, according to PolyBrite International, Inc., developer of the Borealis® brand Light Emitting Diode (LED) Lighting Systems. The City…read more
Carbon Nanotubes Enable Pumpless Liquid Cooling System for Computers
August 23rd, 2010
Purdue University researchers, led by Suresh V. Garimella, have developed a new design employing carbon Nanotubes and small copper spheres that wicks water passively towards hot electronics that could meet the challenges brought on by…read more
Lies, Damned Lies, and “CFD Comparison Charts” – Part II
August 12th, 2010
In my last post I pointed out a very obvious mistake in Blue Ridge Numerics’ “CFD Comparison Chart” of March 19th this year, which incorrectly stated that FloEFD can only handle incompressible sub-sonic flows.
The reason I highlighted this as the most obvious mistake in the “CFD Comparison Chart” is that FloEFD can trace its history [...]
Light Tack Adhesive Eases Fitting of Thermal Interface Pads
August 10th, 2010
MH&W International now provides U 90 silicone-free thermal interface materials with a new light tack adhesive to provide high thermal conductivity where contamination threats prevent the use of silicone-based thermal pads, and allow their easy…read more
Embedded Wafer-Level-Packages
August 10th, 2010
Yole Developpement has released its new report on Embedded Wafer-Level-Packaging. This analysis covers both Fan-Out WLP technology development and Chip embedding into PCB laminated substrates. These two infrastructures are emerging at the same time and ramping to…read more
New Catalog Released
August 10th, 2010
Fujipoly announces an Aug. 16 release date for its new Thermal Interface Material and Elastomeric Connector product catalog. The free 52-page product overview and technical design guide includes installation suggestions, as well as detailed thermal…read more
Ultra-Thin Waterproof Piezoelectric Speaker
August 10th, 2010
Murata Electronics North America recently launched an ultra-thin waterproof piezoelectric speaker. With a thickness of only 0.9mm, this 19.5mm x 14.1mm speaker enables greater design freedom for the rapidly growing and evolving mobile market. The…read more
Eaton Brings On-board Enclosure to Data Centers
August 10th, 2010
Industrial conglomerate Eaton Corp has agreed to buy Wright Line Holding Inc., a privately held maker of enclosures and racks for electronics for data centers, Eaton said on Wednesday. Terms were not disclosed. Wright Line…read more
ACT Launches Technical Services Business Group
August 10th, 2010
Advanced Cooling Technologies, Inc. (ACT) launched a new Technical Services business group, which offers a range of thermal engineering services to a wide variety of private and government organizations. These services range from initial concept…read more
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