Newark has established an exclusive stocking agreement for Wakefield Solutions’ new LED heat sink extrusions. Wakefield and Bridgelux engineering teams worked together at Newark’s behest to design an optimal heat sink extrusion line which is…read more
Active Noise Reduction Solution Integrates Fully into Fan
August 22nd, 2011
The RotoSub R-ANC enables the fan to reduce its own noise. RotoSub R-ANC is an active noise reduction solution that integrates fully into the fan itself. The solution reduces its noise without increasing the size…read more
InGaAs Array Spectrometers Offer Extended Spectral Range
August 22nd, 2011
B&W Tek, Inc.’s enhanced series of TE Cooled fiber-coupled InGaAs array spectrometers, the Sol™ series, offer extended spectral range and high spectral resolution options along with deeper TE Cooling. All four spectrometers in the series…read more
New Thermistors Data Book
August 22nd, 2011
TDK-EPC Corporation has published a new data book featuring the comprehensive product range of EPCOS SMD NTC thermistors. The data book presents detailed technical information explaining the mode of operation of the components and enables…read more
IEC Releases Thermal Management Standard
August 22nd, 2011
IEC/TS 62610-2:2011 provides for compatible methods of forced air cooled cabinets assembled with associated subracks and/or chassis in accordance with IEC 60297 and IEC 60917 series. This design guide contains the following: Thermal interfaces of…read more
Company to Supply DC Power Distribution System to Green Data Center
August 22nd, 2011
ABB will design and install an advanced, DC power distribution system for green.ch, one of the top information and communications technology (ITC) service providers in Switzerland. ABB will install a fully redundant 1 megawatt DC…read more
Military Demands Propel Thermal Management Solutions
August 22nd, 2011
Military programs continue to push the limits of computing system requirements necessitating rugged computer systems to continue to evolve to endure the toughest conditions. To meet these requirements, rugged subsystems suppliers have to produce innovative…read more
Affordable Solar Panels
August 22nd, 2011
Applied Nanotech has developed a way to make some solar technology cheaper, which could reduce the cost of solar panels. Solar panels are made up of a collection of solar wafers, and the company is…read more
Data Center World
August 22nd, 2011
Sept. 11-14, Orlando, Fl. Data Center World is the largest global event of its kind and has been named one of the 50 fastest growing tradeshows in the U.S. It is the leading educational conference…read more
Defense Systems Summit
August 22nd, 2011
Sept. 7, Arlington, Va. This free 1-day event is dedicated to the protection of our country’s critical warfare computing environments. You’ll learn strategies and best practices for securing command IT systems and get tactics for…read more
Dispensing and Coating Seminars
August 22nd, 2011
Sept. 14-15, Ottawa, Canada Nordson ASYMTEK will host a free technical seminar on conformal coating, dispensing and jetting applications and innovations and the fluids, equipment and manufacturing techniques to implement them. The conformal coating seminar…read more
Underfloor Electric Heating. Part II – Infrared Thermography
August 19th, 2011
3D simulation can provide a detailed prediction of temperature and heat flux values at 10s of 1000s of points in a 3D model, experimental methods are somewhat limited in terms of the wealth of data…read more
Webinar: Data Center CFD Modeling “MUST-DOs”
August 15th, 2011
Aug. 25 There’s a right way and a wrong way to model a data center. Some of today’s common modeling practices overlook some of the critical elements that are required for an accurate representation of…read more
Underfloor Electric Heating. Part I: In by Christmas
August 11th, 2011
It’s been over two years since the foundations went in for the extension we’re building on our house. In that time I’ve come to respect and somewhat rely on glib phrases such as “Good things…read more
Recent Posts
- Heatsink System with Modular Cooling Benefits Released
- Rand Worldwide Acquires Thermal Simulation Services Provider
- Counter-Rotating Fans for High-Density Electronic Enclosures
- “Transverse” Thermoelectric Effect May Lead to Better Cooling Devices
- Effectively Leveraging CAD Data in Electronics Thermal Simulation
- Beware… When Cooling Practices Fail! Webinar Part II
- Not Needing to Adjust Hot-Wire Anemometer Reading for Elevated Temperatures. Why Not?
- ‘Normalized Transient Thermal Response’ Curves – Can You be More Clear?
Latest Issue
Don’t miss out on
the June 2013 issue
of Electronics Cooling, which includes feature articles on Thermal Spreading and More Using Open-Source FEA Software; Two-Phase Flow Control of On-Chip Two-Phase Cooling Systems Developed for Blade Servers of Data Centers, and more.
View Issue »
Popular Posts
- The Seebeck Coefficient 4 comment(s)
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 2 comment(s)
- The Thermal Conductivity of Moist Air 5 comment(s)
- Advances In High-Performance Cooling For Electronics 13 comment(s)
- Heat pipes for electronics cooling applications 8 comment(s)
- Notes on Using Thermocouples 11 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 18 comment(s)
- Thermal Conductivity of Solders 2 comment(s)
