If you target buyers outside North America, you may find recent Forrester research and forecasts regarding worldwide mobile Internet access interesting. Forrester forecasts that by 2014, 65% of the world’s population will own at least…read more
Converter Family Maximizes Power Supply Efficiency, Minimizes Footprint
September 27th, 2011
Power Integrations introduced HiperLCS, a family of high-voltage LLC power supply ICs that incorporate the controller, high- and low-side drivers, and both MOSFETs into a single low-cost package. Highly integrated HiperLCS ICs offer the flexibility…read more
DC Fans Feature Reinforced Core Structure
September 27th, 2011
Cooltron Industrial Inc.’s new line of high performance DC fans features a reinforced core structure with metal tubes using premium materials, long life bearings and cutting edge designs. Designed especially for high end applications such…read more
Fluoropolymer Composite and Liquid-Crystal-Polymer Laminates
September 27th, 2011
Rogers Corporation’s RT/duroid 6035HTC is a high-thermal-conductivity fluoropolymer composite that contains a unique filler system, enabling a thermal conductivity of 1.44 W/m/K while maintaining low drill wear. The thermally stable material has a z-axis dielectric constant…read more
Electrical Insulation Systems Standard
September 27th, 2011
IEC/TS 62332-1:2011(E) is applicable to EIS containing solid and liquid components where the thermal stress is the dominant ageing factor, without restriction to voltage class. This part specifies a dual-temperature test procedure for the thermal…read more
Company Expanding North American Operations in Central Ohio
September 27th, 2011
Rittal Corporation is expanding its North American operations in Urbana with plans to create nearly 120 new jobs by 2016. This 20% increase in new positions will encompass all areas of the company from production…read more
Companies Team Up to Develop Adhesives to Create 3D Semiconductors
September 27th, 2011
3M and IBM plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon “towers.” The companies are aiming to create a new class of materials, which will…read more
Yale Engineers Invent Magnetic Fluid Pump with No Moving Parts
September 27th, 2011
In a study published today in Physical Review B, Yale electrical engineering professor Hur Koser and colleagues from the University of Georgia and Massachusetts Institute of Technology demonstrate for the first time an approach that…read more
Call for Papers: 2012 IEEE International Electrical Vehicle Conference
September 23rd, 2011
Oct. 15 IEEE International Electric Vehicle Conference (IEVC) organizers are seeking technical papers on the technology, standards and engineering of electric vehicles. Of specific interest for this conference are papers related but not limited to…read more
Call for Papers: 62nd ECTC
September 23rd, 2011
Oct. 10 Mark your calendars! October 10, 2011 is the deadline to submit an abstract and/or a Professional Development Course (PDC) proposal about new developments and technology related to the following: Advanced Packaging Applied Reliability…read more
Electronics, Solar Energy and New Technologies
September 23rd, 2011
Sept. 27, Marlborough, Mass. Alternative energy, in particular solar PV, is a major growth area for new companies, materials companies, equipment suppliers and EMS providers in the electronics industry, both in the panels and balance…read more
Low Compression, High Performance Thermal Gap Filler
September 12th, 2011
Fujipoly’s new Sarcon® GR-SL is a low compression and high-performance thermal gap filler material. When placed on top of uneven components, this material quickly conforms to all gaps, peeks and air pockets making a level,…read more
Octal Voltage, Current & Temperature Monitor Provides Remote Measurements
September 12th, 2011
Linear Technology Corporation’s new LTC2991 is an 8-channel I²C temperature, voltage and current monitor for 3V and 5V systems. The LTC2991 is a highly integrated monitoring solution that incorporates a 14-bit ADC, 10ppm/°C voltage reference…read more
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