September, 2011

Are You Profiting From the Global Growth of Mobile Buyers?

September 28th, 2011

If you target buyers outside North America, you may find recent Forrester research and forecasts regarding worldwide mobile Internet access interesting. Forrester forecasts that by 2014, 65% of the world’s population will own at least…read more

Converter Family Maximizes Power Supply Efficiency, Minimizes Footprint

September 27th, 2011

Power Integrations introduced HiperLCS, a family of high-voltage LLC power supply ICs that incorporate the controller, high- and low-side drivers, and both MOSFETs into a single low-cost package. Highly integrated HiperLCS ICs offer the flexibility…read more

DC Fans Feature Reinforced Core Structure

September 27th, 2011

Cooltron Industrial Inc.’s new line of high performance DC fans features a reinforced core structure with metal tubes using premium materials, long life bearings and cutting edge designs. Designed especially for high end applications such…read more

Fluoropolymer Composite and Liquid-Crystal-Polymer Laminates

September 27th, 2011

Rogers Corporation’s RT/duroid 6035HTC is a high-thermal-conductivity fluoropolymer composite that contains a unique filler system, enabling a thermal conductivity of 1.44 W/m/K while maintaining low drill wear. The thermally stable material has a z-axis dielectric constant…read more

Electrical Insulation Systems Standard

September 27th, 2011

IEC/TS 62332-1:2011(E) is applicable to EIS containing solid and liquid components where the thermal stress is the dominant ageing factor, without restriction to voltage class. This part specifies a dual-temperature test procedure for the thermal…read more

Company Expanding North American Operations in Central Ohio

September 27th, 2011

Rittal Corporation is expanding its North American operations in Urbana with plans to create nearly 120 new jobs by 2016. This 20% increase in new positions will encompass all areas of the company from production…read more

Drive to Find Rare Earth Metals Alternative

September 27th, 2011

A world-leading team of UK engineers has been charged with developing a new motor for electric vehicles that will significantly reduce future dependency on rare earth metals. Sevcon, Cummins Generator Technologies and Newcastle University have…read more

Companies Team Up to Develop Adhesives to Create 3D Semiconductors

September 27th, 2011

3M and IBM plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon “towers.” The companies are aiming to create a new class of materials, which will…read more

Yale Engineers Invent Magnetic Fluid Pump with No Moving Parts

September 27th, 2011

In a study published today in Physical Review B, Yale electrical engineering professor Hur Koser and colleagues from the University of Georgia and Massachusetts Institute of Technology demonstrate for the first time an approach that…read more

Call for Papers: 2012 IEEE International Electrical Vehicle Conference

September 23rd, 2011

Oct. 15 IEEE International Electric Vehicle Conference (IEVC) organizers are seeking technical papers on the technology, standards and engineering of electric vehicles. Of specific interest for this conference are papers related but not limited to…read more

Call for Papers: 62nd ECTC

September 23rd, 2011

Oct. 10 Mark your calendars! October 10, 2011 is the deadline to submit an abstract and/or a Professional Development Course (PDC) proposal about new developments and technology related to the following: Advanced Packaging Applied Reliability…read more

Electronics, Solar Energy and New Technologies

September 23rd, 2011

Sept. 27, Marlborough, Mass. Alternative energy, in particular solar PV, is a major growth area for new companies, materials companies, equipment suppliers and EMS providers in the electronics industry, both in the panels and balance…read more

Low Compression, High Performance Thermal Gap Filler

September 12th, 2011

Fujipoly’s new Sarcon® GR-SL is a low compression and high-performance thermal gap filler material.  When placed on top of uneven components, this material quickly conforms to all gaps, peeks and air pockets making a level,…read more

Octal Voltage, Current & Temperature Monitor Provides Remote Measurements

September 12th, 2011

Linear Technology Corporation’s new LTC2991 is an 8-channel I²C temperature, voltage and current monitor for 3V and 5V systems. The LTC2991 is a highly integrated monitoring solution that incorporates a 14-bit ADC, 10ppm/°C voltage reference…read more