The 18th International Workshop on Thermal Investigations of ICs and Systems will take place Sept. 25-27 in Budapest, Hungary. The workshops are a series of events to discuss the essential thermal questions of microelectronic microstructures and…read more
Cell Phone Battery Bursts into Flames in Man’s Back Pocket
August 28th, 2012
A cell phone battery spontaneously caught fire last month at a Defcon software hacker’s session – while in the back pocket of the owner’s pants. The phone caught on fire, burned through the anonymous man’s…read more
Graphics Card Cooler with Airflow Direction Options
August 28th, 2012
ARCTIC has developed a graphics card cooler that integrates air and liquid solution together. The Accelero Hybrid 7970 is the first 28nm AMD 7900/7800 series GPUs and offers an all-in-one solution with 200 percent cooling…read more
Requirements for Greases for Aluminium, Aluminium Alloy and Steel Bare Conductors
August 28th, 2012
IEC 61394 ed1.0 provides requirements for greases for aluminium, aluminium alloy and steel bare conductors. View the free download or buy the base production.
Gamers can Improvise Laptop Cooling with Bottle Cap Trick
August 28th, 2012
A technology website has offered a suggestion for those who seek to cool their laptops down as they heat up with gaming or video usage – without using a commercial cooling pad. Users can increase…read more
Expanded FC4L Series of Current Sense Resistors
August 27th, 2012
Ohmite Manufacturing Company, a provider of thermal solutions and resistors for high current, high voltage and high energy applications, announces it has expanded its FC4L Series of four terminal current sense resistors. This series, previously…read more
Photomask Repair Problem Solved
August 27th, 2012
Air Innovations’ ability to address demanding specifications was recently showcased when a global supplier to the semiconductor and photomask-making industries outlined the need for an environmental control unit that could service any of its nanomachining…read more
New Socket Addresses High Performance Requirements
August 27th, 2012
Ironwood Electronics has introduced a new MicroSD socket, SBT-MicroSD-01, addressing high performance requirements for Speed Class Rating, which guarantees a minimum rate at which data can be written to the card. The contactor is a stamped…read more
High Efficiency Thermoelectric Air Conditioners
August 20th, 2012
TECA Corporation has introduced the AHP-4250 family of thermoelectric air conditioners. They have a cooling capacity of 3,600 BTU/HR. “Green Zone” styles have efficiencies approaching 100 percent. Both styles come standard with TECA’s eco-mode temperature…read more
Broader Adoption of Vapor Chamber Technology
August 16th, 2012
Cooler Master has announced the broader adoption of Vapor Chamber Technology developed by Cooler Master’s OEM and industrial cooling division in its retail Heatsinks. Cooler Master is expanding the TPC series and will equip selected…read more
New Heatsink Supports More Package Sizes
August 10th, 2012
Ohmite Manufacturing Company, a provider of thermal solutions and resistors for high current, high voltage and high energy applications, has introduced the Ohmite C Series heatsink which now supports most resistor package sizes from TO-126…read more
Carbon Fiber Sheet Prototype Challenges Thermal Grease
August 9th, 2012
Sony Chemical & Information Device Corp. displayed a prototype of a sheet whose thermal conductivity it claims is equivalent to that of thermal grease and has a longer life span. The sheet, known as EX20000C,…read more
Thermal Endurance Test Procedures Standard
August 9th, 2012
IEC 60034-18-31:2012 describes thermal endurance test procedures for classification of insulation systems used in a.c. or d.c. rotating electrical machines with indirect cooling and form-wound windings. These test procedures are intended to compare the thermal…read more
New Thermally Conductive Silicone Thermal Interface Material
August 6th, 2012
NuSil Technology LLC presents EPM1-2493, a low-viscosity, low modulus silicone elastomer with a nominal thermal conductivity of 1 W/mk. Offering bond lines as thin as 5 microns, EPM1-2493 can be used to adhere materials with…read more
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