Author Archive for Bennett Joiner

Integrated Circuit Package Types And Thermal Characteristics

February 1st, 2006

Introduction Integrated circuits range in power consumption from mW (or maybe microwatts) to hundreds of Watts with the number of electrical connections to the next level packaging ranging from eight to over 1,000. With such…read more

Use of junction-to-board thermal resistance in predictive engineering

January 1st, 1999

The readers of “Electronics Cooling” are familiar with the reasons why the junction to ambient thermal resistance [1], JA or RJA, is an inadequate description of the thermal performance of an integrated circuit. Likewise, you…read more