Author Archive for Bruce Guenin

Calculation Corner: Transient Modelling of a High-Power IC Package, Part 1

November 22nd, 2011

There is an increasing need for calculating integrated circuit temperatures during conditions of changing chip power. Varying computer workloads and the implementation of power-saving strategies are leading to greater variability in chip power levels than…read more

Editorial: The Only Constant is Change … and Thermal Standards

June 13th, 2011

The current millennium has been marked by great change in so many areas — political, economic, cultural, technological, climatic … and the list goes on. I, as I’m sure many of you, often look for…read more

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Use of Power Law Regression in Packaging Thermal Calculations

August 1st, 2009

Introduction In today’s demanding business climate, thermal engineers are often called upon to produce thermal analyses rapidly. For example, there is frequently the need for a quick calculation of a JEDEC-standard thermal performance metric, such…read more

Cooling Solutions In The Past Decade

November 1st, 2005

Introduction In 1995, a typical thermal design engineer was aware that removing heat was not going to get any easier in the next few years. A look back at the past ten years reveals that…read more