Author Archive for J. Richard Culham

Natural convection modeling of heat sinks using web-based tools

September 1st, 2000

Heat transfer in electronic packages is a complex problem involving a network of resistive paths for the various laminated structures, bonding adhesives, lead frames, and attachment mechanisms, such as ball grid arrays. However, despite the…read more

Posted in Design, Heat Pipes, Software, Test & Measurement | No Comments »

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Forced convection cooling inside an electronics enclosure

May 1st, 1998

Introduction One of the more complex thermal problems in electronics is the modeling of complete systems, such as an enclosure containing electronic components. A typical example would be a power supply, including heat sinks and…read more

Posted in Blowers / Fans / Filters, Communications, Computer, Data Centers, Design, Heat Sinks, Test & Measurement | No Comments »

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