Author Archive for Jim Wilson

Thermal Facts and Fairy Tales: Heat Sinks, Heat Exchangers, and History

November 22nd, 2011

As far as history goes, the field of electronics cooling does not have a very long past. A rather quick look through my personal reference material that is strictly geared towards cooling electronics had at…read more

Thermal Facts and Fairytales: Consistency and Accuracy in Simulations

June 13th, 2011

Simulation of temperature fields in electronics is a frequent task for thermal design engineers. Depending on the need and available time, the simulation used to predict temperatures may range from hand calculations to full physics-based…read more

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Technical Data Summary

August 1st, 2009

ElectronicsCooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common…read more

Antifreeze Coolants

February 1st, 2009

Removing waste heat from electronic assemblies using a circulating liquid coolant is a common and effective method with a long and successful history, especially in avionics and data center applications. The choice of coolant depends…read more

Giving Back

November 1st, 2008

haring, Tech nical knowledgeThe A&D group represents a large number of subscribers but their contribution rate measured against authored articles in ElectronicsCooling is underrepresented. Soliciting targeted articles from my coworkers within this industry group has…read more

Heat of Vaporization

August 1st, 2008

Thermal energy transfer associated with a change of phase can be a valuable phenomenon for engineers designing systems for electronics cooling. Solid to liquid phase change materials were described in the May 2005 Technical Data…read more

en Route to a Greener Thermal Technology

February 1st, 2008

It’s no surprise. Power levels in the data center keep rising. In fact, the cost of powering the computers in the data center is beginning to exceed the cost of the computers themselves. The computer…read more

Thermal Properties Of Building Materials

February 1st, 2008

Previous Technical Data columns have covered thermal properties for many of the materials that are common to electronics packaging. The Technical Data for this issue is broader in scope and addresses common building materials, some…read more

Providing More Value Than Playing Video Games

November 1st, 2007

ElectronicsCooling magazine was founded more than 12 years ago with a mission of providing current and practical thermal management information with archival value. I hope you agree this magazine is still delivering on its original…read more

Thermal Diffusivity

August 1st, 2007

Thermal diffusivity is a measure of the transient thermal response of a material to a change in temperature and the term thermal diffusivity (α) is defined as α = k/(ρ x cp) where α is…read more

Moisture permeation in electronics

May 1st, 2007

Environmental control for electronic packages and enclosures often involves understanding and managing moisture concentration. Excessive moisture combined with processing temperatures can cause damage. High humidity levels have other potentially harmful effects such as corrosion. Since…read more

Thermal conductivity of common alloys in electronics packaging

February 1st, 2007

Thermal conductivity of common alloys in electronics packaging Jim Wilson, Associate Technical Editor   Property Thermal Conductivity (W/mK) @25°C CTE (ppm/°C) @25°C Copper 395 17.1 Aluminum 200 23.5 CuMo 160-185 7.0-9.0 CuW 180-220 6.5-8.5 Kovar…read more

Thermal Conductivity of Solders

August 1st, 2006

Soldering has been a primary method of establishing mechanical and electrical connections in electronics for many years and will likely be used in this fashion in the future. While there are several physical properties and…read more

Thermal Conductivity of III-V Semiconductors

February 1st, 2006

Silicon dominates the electronics industry as the semiconductor of choice for most applications, but some electrical functions require electronic properties different from those of silicon. A grouping of semiconductors termed “III-V” have desirable electrical properties…read more