Ceramics

Registration for Thermal Conference Opens

March 21st, 2016

ITherm 2016 has now opened registration for the conference running from May 31 to June 3, 2016 at the Cosmopolitan Hotel in Las Vegas, Nevada. ITherm 2016 is the leading international conference for scientific and…read more

Higher Temperature Rated MLC Capacitors Announced

March 1st, 2016

Knowles brand, Dielectric Laboratories (DLI), has taken temperature performance to a level of 175°C in their Ultra-low ESR and High Q MLC capacitors. DLI detailed the following: “UL is an EIA Class I Stable TC,…read more

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High Temperature Capacitors Could Remove Need for EV Cooling Systems

August 8th, 2013

A new lead-free, high temperature ceramic capacitor developed by scientists at the National Physical Laboratory (NPL), UK could improve the efficiency and reliability of electric and hybrid vehicles by enabling the removal of heavy complex…read more

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GE Announces Dual Piezoelectric Cooling Jet Manufacturing Partnership

February 7th, 2013

General Electric has announced a partnership with semiconductor company Texas Instruments to manufacture the company’s dual piezoelectric cooling jet technology first unveiled in December 2012. According to General Electric, the dual piezoelectric cooling jet technology…read more

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New Cooling Method Based on Military Fighter Jet Air Flow Technology

December 17th, 2012

Engineers at GE Global Research have unveiled a new method of moving air in order to cool consumer electronics based on technology used to improve air flow in military fighter jets. Tentatively known as a…read more

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High Temperature Felt and Millboard Ideal for Industrial Appliances

March 9th, 2012

Morgan Thermal Ceramics announces the availability of its Superwool® HT™ Felt and Superwool® HT™ Millboard, ideal for fabricating gaskets and heat shields for industrial appliances, including ovens, fryers and cooking equipment. The lightweight, multi-purpose products…read more

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30 GHz Leadless Chip Carrier Packaging Platform

March 18th, 2011

Tektronix Component Solutions’ new 30 GHz leadless chip carrier packaging platform meets the broadband performance requirements demanded by telecommunications systems and modules, military/aerospace applications, and terrestrial communications. Tektronix Component Solutions’ LCC platform is suitable for…read more

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Ceramic Pump Components for Hybrid Cars

March 18th, 2011

Morgan Technical Ceramics is providing ceramic components for three water cooling pumps that will be used in hybrid and electric vehicles to cool the high energy battery, the cabin heater and the power electronics loop…read more

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Micro Porous Ceramic Heat Sinks Enhance Heat Dissipation

November 9th, 2010

AMEC Thermasol has introduced a new range of Micro Porous Ceramic Heat Sinks (MPCHS). Due to the open irregular structure of the Micro Porous Ceramic, the heat sinks provide a greater surface area to contact…read more

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Technical Data Summary

August 1st, 2009

ElectronicsCooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common…read more

Glass: A Group Of Familiar Materials With Varying Properties

February 1st, 2003

The knowledge to manufacture glass products is already 4500 – 5000 years old, and glass in its different compounds is one of the most commonly used man-made materials. The material technical definition of glass is…read more

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The Thermal Conductivity of Thermal Insulators

May 1st, 2002

This issue, we present an overview of a number of materials that are often used as thermal insulators. The world would have been much easier for thermal engineers if only the creator had provided us…read more

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Future trends in heat sink design

February 1st, 2001

In today’s electronics equipment, total system dissipated power levels are increasing with every new design. Increases in power levels combined with the market expectation of reduced package sizes lead to heat problems that, if uncontrolled,…read more

Multilayer circuitry on metal substrates

September 1st, 2000

Today’s electronics are becoming smaller and faster, resulting in increased power densities and greater risk of thermal problems. Thermal dissipation requirements thus need to be satisfied by the use of several cooling mechanisms. The cooling…read more