Ceramics

Book Review of Electronics Cooling (2016)

September 6th, 2016

by MP Divakar, PhD, Stack Design Automation Technical Editor, Electronics Cooling Online Electronics cooling engineers and designers are used to one constant in their professional lives: change. Most of it (as far as problem solving…read more

How to Choose the Right Solution for Effective Heat Management

June 7th, 2016

(June 3, 2016) Because electronics have shrunk significantly in recent years, the solutions to cool them must be adjusted. Electropages.com suggests “a case-specific analysis must be performed as each application is subject to different circumstances,”…read more

Posted in Blowers / Fans / Filters, Ceramics, Coolers, Design, Enclosures, Free Air Cooling, Heat Exchanger, Heat Pipes, Heat Sinks, Liquid Cooling, News, Research, Semiconductor | Comments Off on How to Choose the Right Solution for Effective Heat Management

Registration for Thermal Conference Opens

March 21st, 2016

ITherm 2016 has now opened registration for the conference running from May 31 to June 3, 2016 at the Cosmopolitan Hotel in Las Vegas, Nevada. ITherm 2016 is the leading international conference for scientific and…read more

Higher Temperature Rated MLC Capacitors Announced

March 1st, 2016

Knowles brand, Dielectric Laboratories (DLI), has taken temperature performance to a level of 175°C in their Ultra-low ESR and High Q MLC capacitors. DLI detailed the following: “UL is an EIA Class I Stable TC,…read more

Posted in Aerospace, Automotive, Ceramics, Computer, Consumer, Data Centers, Defense, Design, Industrial, Medical, New Products | Comments Off on Higher Temperature Rated MLC Capacitors Announced

High Temperature Capacitors Could Remove Need for EV Cooling Systems

August 8th, 2013

A new lead-free, high temperature ceramic capacitor developed by scientists at the National Physical Laboratory (NPL), UK could improve the efficiency and reliability of electric and hybrid vehicles by enabling the removal of heavy complex…read more

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GE Announces Dual Piezoelectric Cooling Jet Manufacturing Partnership

February 7th, 2013

General Electric has announced a partnership with semiconductor company Texas Instruments to manufacture the company’s dual piezoelectric cooling jet technology first unveiled in December 2012. According to General Electric, the dual piezoelectric cooling jet technology…read more

Posted in Blowers / Fans / Filters, Ceramics, Consumer, News | Comments Off on GE Announces Dual Piezoelectric Cooling Jet Manufacturing Partnership

New Cooling Method Based on Military Fighter Jet Air Flow Technology

December 17th, 2012

Engineers at GE Global Research have unveiled a new method of moving air in order to cool consumer electronics based on technology used to improve air flow in military fighter jets. Tentatively known as a…read more

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High Temperature Felt and Millboard Ideal for Industrial Appliances

March 9th, 2012

Morgan Thermal Ceramics announces the availability of its Superwool® HT™ Felt and Superwool® HT™ Millboard, ideal for fabricating gaskets and heat shields for industrial appliances, including ovens, fryers and cooking equipment. The lightweight, multi-purpose products…read more

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30 GHz Leadless Chip Carrier Packaging Platform

March 18th, 2011

Tektronix Component Solutions’ new 30 GHz leadless chip carrier packaging platform meets the broadband performance requirements demanded by telecommunications systems and modules, military/aerospace applications, and terrestrial communications. Tektronix Component Solutions’ LCC platform is suitable for…read more

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Ceramic Pump Components for Hybrid Cars

March 18th, 2011

Morgan Technical Ceramics is providing ceramic components for three water cooling pumps that will be used in hybrid and electric vehicles to cool the high energy battery, the cabin heater and the power electronics loop…read more

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Micro Porous Ceramic Heat Sinks Enhance Heat Dissipation

November 9th, 2010

AMEC Thermasol has introduced a new range of Micro Porous Ceramic Heat Sinks (MPCHS). Due to the open irregular structure of the Micro Porous Ceramic, the heat sinks provide a greater surface area to contact…read more

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Technical Data Summary

August 1st, 2009

ElectronicsCooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common…read more

Glass: A Group Of Familiar Materials With Varying Properties

February 1st, 2003

The knowledge to manufacture glass products is already 4500 – 5000 years old, and glass in its different compounds is one of the most commonly used man-made materials. The material technical definition of glass is…read more

Posted in Ceramics, Design, Materials, Compounds, Adhesives, Substrates, Technical Data, Test & Measurement | Comments Off on Glass: A Group Of Familiar Materials With Varying Properties

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The Thermal Conductivity of Thermal Insulators

May 1st, 2002

This issue, we present an overview of a number of materials that are often used as thermal insulators. The world would have been much easier for thermal engineers if only the creator had provided us…read more

Posted in Ceramics, Materials, Compounds, Adhesives, Substrates, Semiconductor, Technical Data, Test & Measurement | Comments Off on The Thermal Conductivity of Thermal Insulators

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