Design

Optical Transport Could Replace Wires in Computers

June 2nd, 2015

An article published in Nature Photonics announces a breakthrough in creating faster and more efficient computers. Instead of using wires/electricity to send data back and forth in computers, the Stanford team, including electrical engineer Jelena…read more

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Doctoral Candidate’s Research Could Improve Efficiency of Data Centers

May 26th, 2015

Husam Alissa, a Binghamton University doctoral candidate in mechanical engineering, has been working to improve the efficiency of data centers at the university’s Center for Energy-Smart Electronic Systems (ES2). Alissa’s work focuses on reducing overheating,…read more

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Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense – Extended Article

May 26th, 2015

Dr. Alexander Yatskov Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data center…read more

Posted in Articles, Blowers / Fans / Filters, CFD Software, Coolers, Data Centers, Design, Design, Enclosures, Free Air Cooling, Heat Exchanger, Heat Pipes, Heat Sinks, Liquid Cooling, Refrigeration | Comments Off on Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense – Extended Article

Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense

May 21st, 2015

By: Dr. Alexander Yatskov; Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data…read more

Posted in Articles, Coolers, Data Centers, Design, Enclosures, Heat Exchanger, Heat Pipes | Comments Off on Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense

Data Center Energy Savings: Total Liquid Cooling versus Indirect Liquid Cooling

May 21st, 2015

By: Yong Quiang Chi, Peter Hopton and Keith Deakin, Iceotope Ltd Jonathan Summers, Alan Real, Nik Kapur and Harvey Thompson, University of Leeds Introduction Improvements in energy efficiency and performance of data centers are possible…read more

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Chinese Company Creates Data Center Tech Advances

May 12th, 2015

Shanghai Data Solution, a company owned by the Chinese government, says it is making large strides in the data center industry. “Shanghai Data Solution (SDS) built its first small network communications site in 2001, and…read more

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Thermal Foil Sheets Offer Advanced Thermal Management in Smartphones

April 13th, 2015

Angstron Materials Inc. has developed a family of thermal foil products ideal for smartphones, and other hand-held devices. The new thermal foil sheets have a thickness of from 5 um to 40 um and thermal…read more

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ASU Engineer’s Computing Node Research Suggests Large Reduction in Energy Usage

April 7th, 2015

Carole-Jean Wu, computer scientist and engineer at Arizona State University, is gaining recognition for her work to improve energy efficiency of computing nodes, which includes everything from smartphones and tablets, to desktop processors and data…read more

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Combination of Polymers Yields Advantages for Electronics Manufacturers and Lighting Industry

April 7th, 2015

The high cost of LED bulbs has resulted in manufacturers in the lighting industry to reduce costs and improve performance in the assembly process. Nicolas Sunderland, senior scientist, and Terry G. Davis, principal engineer of…read more

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Heatsink 101: Everything You Ever Wanted to Know Web Seminar

March 26th, 2015

Wednesday, April 1, 2015 2:00 PM – 3:00 PM US/Eastern Online Event This web seminar focuses on how heatsinks work and how to design a heatsink while considering all the critical factors such as size,…read more

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Overheating Issues Stall Release of Sony’s Xperia Z4

March 24th, 2015

The release of Sony’s Xperia Z4 has been delayed due to heat dissipation issues in the Snapdragon 810 processor in the device. The Snapdragon 810 chip reportedly has overheating issues and Sony is working to…read more

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New Data Center Design Reduces Space; Increases Cooling Productivity

March 24th, 2015

One company hopes to create an entirely new design for data centers for the industry. Vapor IO introduces a new “Data Center Aisle” concept.  This vapor chamber design encompasses a room filled with round black…read more

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Clear Encapsulant Ideal for Outdoor LED Lighting Applications

March 23rd, 2015

Dow Corning introduces a new clear and reliable Encapsulant for harsh outdoor LED lighting applications. The EI-1184 Silicone Encapsulant features high transparency, high weatherability, long lasting protection in harsh outdoor and indoor environments, and protection…read more

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Circuit Card Assembly Heat Sinks Embedded With Oscillating Heat Pipes

March 20th, 2015

Joe Boswell, Chris Smoot, Elliot Short, Nate Francis Introduction In this study, lightweight two-phase heat sinks embedded with the Oscillating Heat Pipe (OHP) technology are developed for the thermal management of military circuit card assemblies…read more

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