Design

New “Form-In-Place” Product with Process Demonstration Video

April 22nd, 2016

JONES TECH recently released their newest “Form-In-Place” Product with a video that demonstrates their FIP process. Their thermal product offerings include thermal pads, thermal greases, thermal gels, phase change materials, and synthetic graphite. Jones Tech…read more

Posted in Computer, Design, Design, Materials, Compounds, Adhesives, Substrates, New Products, Thermal Imaging | Comments Off on New “Form-In-Place” Product with Process Demonstration Video

Metal Inverse Opals Could Better Cool Electronics

April 18th, 2016

(April 7th, 2016) New work by researchers at Stanford University and the University of Illinois at Urbana-Champaign, suggest that “metal inverse opals” could be used to cool down electronic devices as well as other thermal…read more

Posted in Computer, Coolers, Design, Design, Heat Exchanger, Heat Pipes, News, Research | Comments Off on Metal Inverse Opals Could Better Cool Electronics

New Approach to Simulate Nanoscale Thermoelectric Materials

April 18th, 2016

(April 7th, 2016) A research group led by Joe Feser, assistant professor in the Department of Mechanical Engineering at the University of Delaware, has developed a new approach to simulating nanoscale heat transfer in materials,…read more

Posted in Design, Heat Exchanger, News, Power, Research, Test & Measurement | Comments Off on New Approach to Simulate Nanoscale Thermoelectric Materials

Small EHD Pump Solution May Cool Space Hardware

April 18th, 2016

(April 13th, 2016) Michal Talmor, a Ph.D. candidate in mechanical engineering at the Worcester Polytechnic Institute (WPI) in Worcester, Massachusetts, is focused on bringing electrohydrodynamic (EHD)-based thermal control to space exploration devices. Now in the…read more

Posted in Aerospace, Design, Design, Heat Exchanger, News, Research | Comments Off on Small EHD Pump Solution May Cool Space Hardware

iNEMI ROADMAP IDENTIFIES TRENDS IMPACTING ELECTRONICS THERMAL MANAGEMENT

April 14th, 2016

iNEMI ROADMAP IDENTIFIES TRENDS IMPACTING ELECTRONICS THERMAL MANAGEMENT   PREFACE The International Electronics Manufacturing Initiative (iNEMI) is an industry-led consortium of approximately 100 leading electronics manufacturers, suppliers, associations, government agencies and universities. One of iNEMI’s…read more

Posted in Articles, Design, Heat Pipes, Liquid Cooling, Materials, Compounds, Adhesives, Substrates, TIMs | Comments Off on iNEMI ROADMAP IDENTIFIES TRENDS IMPACTING ELECTRONICS THERMAL MANAGEMENT

World’s Thinnest Laptop Runs on ‘Hyperbaric’ Cooling

April 11th, 2016

HP has recently released the world’s thinnest laptop – the Spectre 13.3” notebook, which cools its CPUs with what HP calls ‘hyperbaric cooling technology’. This system features two ultra-thin fans, a heat-pipe, and a special…read more

Posted in Blowers / Fans / Filters, Computer, Design, Design, Heat Pipes, News | Comments Off on World’s Thinnest Laptop Runs on ‘Hyperbaric’ Cooling

Formula Developed for Heat Transfer Between Near-Field Bodies

April 11th, 2016

Alejandro Rodriguez, a researcher at Princeton, and colleagues at the Massachusetts Institute of Technology have come up with a formula that describes the maximum heat transfer between near-field objects in a recent study. Phys.org claimed…read more

Posted in Design, Design, Materials, Compounds, Adhesives, Substrates, News, Research | Comments Off on Formula Developed for Heat Transfer Between Near-Field Bodies

New Power Electronics Will Allow Army Vehicles’ Electronics to Operate at High Temperatures

April 4th, 2016

The US Army has awarded GE Aviation with a contract to develop silicon carbide-based power electronics that will allow high-voltage, next-generation ground vehicles to operate at higher temperatures. “The US Army’s implementation of [this technology…read more

Posted in Automotive, Defense, Design, Design, Materials, Compounds, Adhesives, Substrates, News, Plastics, Power | Comments Off on New Power Electronics Will Allow Army Vehicles’ Electronics to Operate at High Temperatures

Overheating Causes 911 System Failure

April 4th, 2016

Due to a problem with the computer cooling system, 911 service was down for about four hours recently in Buffalo, New York’s Erie County. According to Time Warner Cable News, the room at the Public…read more

Posted in Communications, Computer, Coolers, Design, Design, Medical, News, Power | Comments Off on Overheating Causes 911 System Failure

Smart Clothing That Automatically Cools Itself

April 4th, 2016

VTT Technical Research Centre of Finland Ltd has recently developed a technology that can be utilized in smart fabrics and clothing to cool or warm the wearer according to his or her needs as part…read more

Posted in Consumer, Coolers, Design, Design, Medical, News | Comments Off on Smart Clothing That Automatically Cools Itself

Diamonds May Take Silicon’s Place in Future Smartphones

March 28th, 2016

A startup called Akhan Semi suggests lab-grown diamonds can cool electronics more efficiently than silicon. Silicon costs a lot to keep cool, but lab-grown diamonds could eliminate cooling fans and heat sinks since they already…read more

Posted in Blowers / Fans / Filters, Communications, Computer, Consumer, Design, Design, Heat Sinks, News, Power, Research, Semiconductor | Comments Off on Diamonds May Take Silicon’s Place in Future Smartphones

Overcoming Cooling Challenges Downloadable Webinar Now Available

March 21st, 2016

The recent Electronics Cooling with Autodesk CFD Webinar on how to ensure proper cooling as the electronics used in products change and improve is now available for download. Exploring ‘invisible elements’ like airflow and heat…read more

Posted in Consumer, Coolers, Design, Design, Heat Exchanger, News, Plastics, Research, Semiconductor, Test & Measurement | Comments Off on Overcoming Cooling Challenges Downloadable Webinar Now Available

Registration for Thermal Conference Opens

March 21st, 2016

ITherm 2016 has now opened registration for the conference running from May 31 to June 3, 2016 at the Cosmopolitan Hotel in Las Vegas, Nevada. ITherm 2016 is the leading international conference for scientific and…read more

Revolutionary Structure Design Aids in Data Center Cooling

March 17th, 2016

DAMAC, the leading U.S. manufacturer of data center infrastructure equipment, recently unveiled its DAMAC Structure during the Data Center World Global conference in Las Vegas. The structure incorporates an Aisle Containment System, which “encapsulates the…read more

Posted in Data Centers, Design, Design, Enclosures, News | Comments Off on Revolutionary Structure Design Aids in Data Center Cooling