Design

Potential Pitfalls of Hybrid Electrical-Thermal Measurements for Thermal Characterization

February 28th, 2014

Anurag Gupta, David H. Altman, Daniel P. Resler Raytheon Integrated Defense Systems Introduction Electrical resistors are often used to simulate heat-dissipating electronic devices in thermal characterization of semiconductor devices. This article describes a study in…read more

Research Could Lead to New Thermal Flow Control Devices

February 4th, 2014

Researchers have proposed a new method of controlling heat flow similar to the way electronic components handle electrical current that could deliver more efficient thermal management in a variety of applications. Developed by scientists at…read more

Carbon Nanotubes Boost Microprocessor Cooling

February 4th, 2014

Researchers from the U.S. Department of Energy have developed a new technique that combines carbon nanotubes and organic materials to enable more efficient cooling of microprocessor chips. While carbon nanotubes have long been known to…read more

Thermal Management of Many-Core Processors Using Power Multiplexing

December 19th, 2013

Man Prakash Gupta and Satish Kumar G.W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology INTRODUCTION Due to the growing demands of higher performance and faster computing, the number of cores in a microprocessor…read more

Use of JEDEC Thermal Metrics in Calculating Chip Temperatures (without Attached Heat Sinks)

December 19th, 2013

Bruce Guenin Assoc. Technical Editor, Electronics Cooling INTRODUCTION JEDEC single-chip package thermal metrics are widely used as a means of characterizing the thermal performance of semiconductor packages. They correlate the peak temperature of a uniformly-heated…read more

Bitcoin Mining Boosts Interest in Liquid Cooling

December 5th, 2013

A journalist’s recent visit to a secret Hong Kong Bitcoin mining facility reveals some of the newer cooling techniques in use to keep server temperatures from skyrocketing. Introduced in 2009, Bitcoin is an open-source peer-to-peer…read more

Thermal Facts and Fairy Tales: Evolving the Role of the Thermal Engineer from Analyst to Architect

December 5th, 2013

Scott Johnson, Raytheon Space and Airborne Systems Brendon Holt, Raytheon Missile Systems   Evolving trends within the aerospace industry are creating a new set of challenges that directly influence thermal management choices and planning that…read more

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Defense Contractors to Develop Next-Gen Military Electronics Thermal Management

November 11th, 2013

U.S. Air Force officials have awarded multimillion dollar contracts to BAE Systems and Boeing Co. as part of DARPA’s Intrachip/Interchip Enhanced Cooling Applications (ICECool Applications) program. The ICECool program seeks to develop advanced electronics cooling…read more

Webinar Question & Answer Session

November 8th, 2013

Editor’s note: This question was asked in response to Electronics Cooling’s recent webinar by Carl Zwebin. To view the webinar, click here. Question: Are these graphite based materials compressible? Answer: In general, they are not…read more

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Waterproof Tablet Computer Features Cooling Fan

November 8th, 2013

Electronics manufacturer Fujitsu has released a unique new tablet computer capable of operating underwater while using a cooling fan to pump heat away from sensitive internal circuitry. The Arrows Tab QH77/M is 2-in-1 computer that…read more

Thermal Connectors Improve PCB Assembly Heat Dissipation

November 7th, 2013

TEM Products Inc., a manufacturer of mechanical components for electro-mechanical assembly, has released its new patent-pending PowerPeg thermal connectors. Designed for attachment to an external dissipater, the new PowerPeg thermal connectors offer significantly improved thermal…read more

New Thermoelectric Material Uses Caged Atoms to Create Electricity

October 7th, 2013

Scientists, at the Vienna University of Technology have developed a new class of thermoelectric materials they claim can be used to create electricity more efficiently. According to the researchers, the material’s unique structure, which consists…read more

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Patent Covers Methods of Making, Cooling Semiconductor Packages

October 7th, 2013

The U.S. Patent and Trademark Office has awarded patent No. 8,546,935, “Semiconductor Packages,” to Micron Technology, Inc. of Boise, Idaho. According to background information provider by the inventors, the patent covers “semiconductor packages having grooves…read more

New Patent Covers System for Clamping Heat Sink

October 7th, 2013

The U.S. Patent and Trademark Office has assigned patent No. 8,546,192, “System for Clamping Heat Sink,” to Harman International Industries, Inc. in Stamford, Conn. According to the background information provided by the inventor, the patent…read more