Design

Formula Developed for Heat Transfer Between Near-Field Bodies

April 11th, 2016

Alejandro Rodriguez, a researcher at Princeton, and colleagues at the Massachusetts Institute of Technology have come up with a formula that describes the maximum heat transfer between near-field objects in a recent study. Phys.org claimed…read more

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New Power Electronics Will Allow Army Vehicles’ Electronics to Operate at High Temperatures

April 4th, 2016

The US Army has awarded GE Aviation with a contract to develop silicon carbide-based power electronics that will allow high-voltage, next-generation ground vehicles to operate at higher temperatures. “The US Army’s implementation of [this technology…read more

Posted in Automotive, Defense, Design, Design, Materials, Compounds, Adhesives, Substrates, News, Plastics, Power | Comments Off on New Power Electronics Will Allow Army Vehicles’ Electronics to Operate at High Temperatures

Overheating Causes 911 System Failure

April 4th, 2016

Due to a problem with the computer cooling system, 911 service was down for about four hours recently in Buffalo, New York’s Erie County. According to Time Warner Cable News, the room at the Public…read more

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Smart Clothing That Automatically Cools Itself

April 4th, 2016

VTT Technical Research Centre of Finland Ltd has recently developed a technology that can be utilized in smart fabrics and clothing to cool or warm the wearer according to his or her needs as part…read more

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Diamonds May Take Silicon’s Place in Future Smartphones

March 28th, 2016

A startup called Akhan Semi suggests lab-grown diamonds can cool electronics more efficiently than silicon. Silicon costs a lot to keep cool, but lab-grown diamonds could eliminate cooling fans and heat sinks since they already…read more

Posted in Blowers / Fans / Filters, Communications, Computer, Consumer, Design, Design, Heat Sinks, News, Power, Research, Semiconductor | Comments Off on Diamonds May Take Silicon’s Place in Future Smartphones

Overcoming Cooling Challenges Downloadable Webinar Now Available

March 21st, 2016

The recent Electronics Cooling with Autodesk CFD Webinar on how to ensure proper cooling as the electronics used in products change and improve is now available for download. Exploring ‘invisible elements’ like airflow and heat…read more

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Registration for Thermal Conference Opens

March 21st, 2016

ITherm 2016 has now opened registration for the conference running from May 31 to June 3, 2016 at the Cosmopolitan Hotel in Las Vegas, Nevada. ITherm 2016 is the leading international conference for scientific and…read more

Revolutionary Structure Design Aids in Data Center Cooling

March 17th, 2016

DAMAC, the leading U.S. manufacturer of data center infrastructure equipment, recently unveiled its DAMAC Structure during the Data Center World Global conference in Las Vegas. The structure incorporates an Aisle Containment System, which “encapsulates the…read more

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NSA Finally Has a Plan for Their Superconducting Supercomputer

March 7th, 2016

The U.S. government has its eyes on “cryogenically cooled circuitry for tomorrow’s exascale computers,” reported Spectrum.IEEE.org, a dream over 50 years old. An electrical engineer of the NSA, Dudley Buck, “reported on his own work”…read more

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More Energy Efficient Future Supercomputers Thanks to ATP Chemical Found in Humans

March 7th, 2016

Recently, scientists from McGill University have discovered that ATP, “a chemical which provides energy to cells inside the human body, could also power an energy efficient biological supercomputer,” according to Valuewalk.com. Valuewalk said the researchers…read more

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New PWM Temperature Controller for Liquid Chiller

February 19th, 2016

TECA Corporation’s TLC-900 Bench Top Liquid Chiller has recently been upgraded with a Pulse Width Modulating (PWM) controller incorporating four PID temperature ranges. This upgrade will improve temperature control over a wide temperature range while…read more

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Fan Designs New Smartphone That Uses Liquid Cooling

February 19th, 2016

An Asus fan has conceptualized his ideal gaming Asus smartphone, naming it the “Asus Z2 Poseidon”. “…The smartphone is said to come with a factory-installed Fujitsu-manufactured liquid cooling setup, something that is usually seen in…read more

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Electronics Cooling with Autodesk CFD

February 9th, 2016

  Electronics Cooling with Autodesk CFD WEBINAR See the invisible. Maximize product performance.   To view the recording of this webinar, click here.   Who should attend:  Analysts, Engineers, those involved in industries including electronics…read more

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New Liquid Cooled HPC Cluster Launched

February 8th, 2016

CoolIT Systems has successfully completed the second deployment of its Rack DCLC™ liquid cooling solution at the Poznan Supercomputing and Networking Center (PSNC) in partnership with Huawei. The liquid cooled solution is part of the HPC…read more

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