Design

Webinar Question & Answer Session

November 8th, 2013

Editor’s note: This question was asked in response to Electronics Cooling’s recent webinar by Carl Zwebin. To view the webinar, click here. Question: Are these graphite based materials compressible? Answer: In general, they are not…read more

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Waterproof Tablet Computer Features Cooling Fan

November 8th, 2013

Electronics manufacturer Fujitsu has released a unique new tablet computer capable of operating underwater while using a cooling fan to pump heat away from sensitive internal circuitry. The Arrows Tab QH77/M is 2-in-1 computer that…read more

Thermal Connectors Improve PCB Assembly Heat Dissipation

November 7th, 2013

TEM Products Inc., a manufacturer of mechanical components for electro-mechanical assembly, has released its new patent-pending PowerPeg thermal connectors. Designed for attachment to an external dissipater, the new PowerPeg thermal connectors offer significantly improved thermal…read more

New Thermoelectric Material Uses Caged Atoms to Create Electricity

October 7th, 2013

Scientists, at the Vienna University of Technology have developed a new class of thermoelectric materials they claim can be used to create electricity more efficiently. According to the researchers, the material’s unique structure, which consists…read more

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Patent Covers Methods of Making, Cooling Semiconductor Packages

October 7th, 2013

The U.S. Patent and Trademark Office has awarded patent No. 8,546,935, “Semiconductor Packages,” to Micron Technology, Inc. of Boise, Idaho. According to background information provider by the inventors, the patent covers “semiconductor packages having grooves…read more

New Patent Covers System for Clamping Heat Sink

October 7th, 2013

The U.S. Patent and Trademark Office has assigned patent No. 8,546,192, “System for Clamping Heat Sink,” to Harman International Industries, Inc. in Stamford, Conn. According to the background information provided by the inventor, the patent…read more

View our Webinar and Q&A on ‘Advanced Carbon-Based Thermal Management Materials and Applications ’

September 25th, 2013

On September 25, 2013, Carl Zweben presented a live webinar on Advanced Carbon-Based Thermal Management Materials and Applications. Overview: In this webinar, we consider advanced carbonaceous (carbon-based) materials, which are now well established, and are…read more

To What do you Attribute the Success of Al/SiC?

September 9th, 2013

Editor’s note: This question was asked in response to Electronics Cooling’s recent webinar by Carl Zwebin. To view the webinar, click here. Question: To what do you attribute the success of Al/SiC? Answer: Al/SiC composites…read more

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Electronics Cooling September 2013 Issue Now Online

September 1st, 2013

Don’t miss out on the September 2013  issue of Electronics Cooling, which includes feature articles on Heat Pipe Integration Strategies for LED Applications; Testing of power LEDs: The latest thermal testing standards from JEDEC, as…read more

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Are There Ways to Use Some of the More Expensive Materials in Cost-sensitive Applications?

August 26th, 2013

Editor’s note: This question was asked in response to Electronics Cooling’s recent webinar by Carl Zwebin. To view the webinar, click here. Question: Are there ways to use some of the more expensive materials in…read more

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Are the Carbon Fibers Used in Aircraft Like the Boeing 787 Thermally Conductive?

August 13th, 2013

Editor’s note: This question was asked in response to Electronics Cooling’s recent webinar by Carl Zwebin. To view the webinar, click here. Question: Are the carbon fibers used in aircraft like the Boeing 787 thermally…read more

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Thermal Conductivity of diamond-Ag Composites was Quoted at 983W/mK – Missing Something?

July 22nd, 2013

Editor’s note: This question was asked in response to Electronics Cooling’s recent webinar by Carl Zwebin. To view the webinar, click here. 1. Question: The thermal conductivity of diamond-Ag composites was quoted at 983W/mK.  This…read more

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Info on Advanced Composite Thermal Materials and Costs of Materials

July 22nd, 2013

  Editor’s note: This question was asked in response to Electronics Cooling’s recent webinar by Carl Zwebin. To view the webinar, click here. Question: Where can I get more information on advanced composite thermal management…read more

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Radiative Cooling of Electronics (and Other Things)

June 21st, 2013

In your basic heat transfer class, you should have learned that there are three primary modes of heat transfer: conduction (heat transfer through solids or stationary fluids), convection (heat transfer by virtue of moving fluids),…read more