Design

University Installs Liquid-cooling Solution

June 23rd, 2015

CoolIT Systems has successfully installed its liquid cooling DCLC rack at the Center for Biological Sequence Analysis at the Technical University of Denmark (DTU). The DCLC rack uses waste heat and converts it into usable…read more

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Reducing Reliance on Water for Cooling in Data Centers

June 9th, 2015

The severe drought in California has spiked concerns about the availability of water to operate data centers. Since water is extremely important for cooling facilities, other approaches of water usage in data centers reportedly need…read more

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Researchers Successfully Measure Thermoelectric Behavior for the First Time

June 9th, 2015

A team from Sandia National Laboratories has made the first measurement of thermoelectric behavior via nanoporous metal-organic framework (MOF). This discovery could produce a new class of materials in the future that would improve upon…read more

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Qualcomm Refutes Overheating Rumors

June 2nd, 2015

In March 2015, Sony’s Xperia Z4 reportedly experienced overheating issues in the Snapdragon 810 processor inside the device.  (Read original article here). The issue began when ArsTechnica tested and confirmed that the Snapdragon 808 runs…read more

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Largest Data Center in Asia to be Completed in July 2015

June 2nd, 2015

LG U+, a telecommunications company in Gyeonggi, South Korea, announced its mega data center will be completed in Pyeongchon in July 2015. When completed, it will be the largest data center in Asia and the…read more

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Optical Transport Could Replace Wires in Computers

June 2nd, 2015

An article published in Nature Photonics announces a breakthrough in creating faster and more efficient computers. Instead of using wires/electricity to send data back and forth in computers, the Stanford team, including electrical engineer Jelena…read more

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Doctoral Candidate’s Research Could Improve Efficiency of Data Centers

May 26th, 2015

Husam Alissa, a Binghamton University doctoral candidate in mechanical engineering, has been working to improve the efficiency of data centers at the university’s Center for Energy-Smart Electronic Systems (ES2). Alissa’s work focuses on reducing overheating,…read more

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Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense – Extended Article

May 26th, 2015

Dr. Alexander Yatskov Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data center…read more

Posted in Articles, Blowers / Fans / Filters, CFD Software, Coolers, Data Centers, Design, Design, Enclosures, Free Air Cooling, Heat Exchanger, Heat Pipes, Heat Sinks, Liquid Cooling, Refrigeration | Comments Off on Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense – Extended Article

Comparison of HPC/Telecom Data Center Cooling Methods by Operating and Capital Expense

May 21st, 2015

By: Dr. Alexander Yatskov; Thermal Form & Function Inc. Introduction Current high-performance computing (HPC) and Telecom trends have shown that the number of transistors per chip has continued to grow in recent years, and data…read more

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Data Center Energy Savings: Total Liquid Cooling versus Indirect Liquid Cooling

May 21st, 2015

By: Yong Quiang Chi, Peter Hopton and Keith Deakin, Iceotope Ltd Jonathan Summers, Alan Real, Nik Kapur and Harvey Thompson, University of Leeds Introduction Improvements in energy efficiency and performance of data centers are possible…read more

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Chinese Company Creates Data Center Tech Advances

May 12th, 2015

Shanghai Data Solution, a company owned by the Chinese government, says it is making large strides in the data center industry. “Shanghai Data Solution (SDS) built its first small network communications site in 2001, and…read more

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Thermal Foil Sheets Offer Advanced Thermal Management in Smartphones

April 13th, 2015

Angstron Materials Inc. has developed a family of thermal foil products ideal for smartphones, and other hand-held devices. The new thermal foil sheets have a thickness of from 5 um to 40 um and thermal…read more

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ASU Engineer’s Computing Node Research Suggests Large Reduction in Energy Usage

April 7th, 2015

Carole-Jean Wu, computer scientist and engineer at Arizona State University, is gaining recognition for her work to improve energy efficiency of computing nodes, which includes everything from smartphones and tablets, to desktop processors and data…read more

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Combination of Polymers Yields Advantages for Electronics Manufacturers and Lighting Industry

April 7th, 2015

The high cost of LED bulbs has resulted in manufacturers in the lighting industry to reduce costs and improve performance in the assembly process. Nicolas Sunderland, senior scientist, and Terry G. Davis, principal engineer of…read more

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